2009
DOI: 10.1016/j.jmmm.2009.04.015
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Growth temperature dependence of the hysteretic behavior of Ni0.5Zn0.5Fe2O4 thin films

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Cited by 9 publications
(4 citation statements)
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“…In addition, the EPD process has advantages of high deposition rate and low postannealing temperature over sputter deposition [13], pulsed laser deposition [14], sol-gel process [15], and screen printing technique [16].…”
Section: Resultsmentioning
confidence: 99%
“…In addition, the EPD process has advantages of high deposition rate and low postannealing temperature over sputter deposition [13], pulsed laser deposition [14], sol-gel process [15], and screen printing technique [16].…”
Section: Resultsmentioning
confidence: 99%
“…Substrate heating at 350uC, however, induces the formation of minor cubic phases such as Ta-Mo (111), ( 110) and (221) as well. 16 It seems that the Ta-Mo phase was formed due to the reaction between Ta and Mo atomics in the ion bombardment at the process of substrate heating. Also, there is a little change in XRD spectra for polycrystalline Ta-Mo coatings deposited at 450uC, which indicates that the sputtering temperatures lower than 450uC produce partial recrystallinity of Ta-Mo microstructures.…”
Section: Resultsmentioning
confidence: 99%
“…It reveals that the full recrystallinity of Ta–Mo microstructures at planes of Ta–Mo (111) and (221) occurred in the coatings deposited at 550°C. This is due to the fact that the increase in ion bombardment accelerates the surface moving and surface diffusion, and thus improves the grain quality of the Ta–Mo (111) and (221) metastable phases 17…”
Section: Resultsmentioning
confidence: 99%
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