H133 Surface Temperature of Smart Phone Case Using High Thermal Conductive Materials

Abstract

As sma 苴 phones become more complex ， higher in performance and smaller in size ， heat ooncentradon at localized areas is becoming a problem ． Therefore ， the aim of this paper is to examine the effect ofhigh thermal conductive materials for heat dissipation in order to solve this problem ． The thermal conduc 廿vity of 血 e outer case of the sman phone was changed using finite element method ( FEM ) to simulate high thermal conduc 廿ve materials or composite materials with anisotropy ． The Inaximum temperature gradually decreased and the minimum 胎 mperature grad圃 ly increased with increasing the thermal conduc 缸 vity of the outer case ， Moreover ， 血 ethemlal conductivity in the longer砒 ection of the smart phone was important for lowering the maximum temperature ． In this paper， it is found that applying high therrnal conductive materials to the outer case is effective fbr uniforrning the heat dispersing ．