2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2019
DOI: 10.1109/fleps.2019.8792244
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Half-volt IGZO flexible thin-film transistors with E-beam deposited Al2O3 gate dielectric

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Cited by 5 publications
(4 citation statements)
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“…Subsequently, an aluminum oxide (Al2O3) dielectric layer of 60 nm thick was deposited using Leybold350 Electron-beam evaporator using 1-3mm of clear Al2O3 pieces with 99.99% purity. The deposition rate was kept below 2 Å s -1 for uniform layer deposition [28]. The optimum thickness for the Al2O3 gateoxide film was measured at 60 nm based upon electrical data.…”
Section: B Tft Fabrication and Testingmentioning
confidence: 99%
“…Subsequently, an aluminum oxide (Al2O3) dielectric layer of 60 nm thick was deposited using Leybold350 Electron-beam evaporator using 1-3mm of clear Al2O3 pieces with 99.99% purity. The deposition rate was kept below 2 Å s -1 for uniform layer deposition [28]. The optimum thickness for the Al2O3 gateoxide film was measured at 60 nm based upon electrical data.…”
Section: B Tft Fabrication and Testingmentioning
confidence: 99%
“…TFT devices with high performance in terms of mobility and stability have been reported [57]- [59]. The typical supply voltage of a-IGZO TFTs ranges between 5-30 V, however recently a-IGZO TFTs operated at 1 V or less have been described [60], [61]. The nominal transition frequency (f T ) of these devices lies in the MHz regime [62].…”
Section: A-igzo Tft Technologymentioning
confidence: 99%
“…Recent advances in technology have resulted in some fruitful results in the direction of low voltage flexible technologies. Recently, TFTs operating at 1-V or lower supply voltages have been reported [60], [61]. However, complex circuits built with such devices have still not been demonstrated.…”
Section: E Interfaces With Silicon-based Circuitsmentioning
confidence: 99%
“…However, the material composition varies tremendously with application, design, functionality, manufacturing route, and application. The most common material is based on the composite material FR-4 and planar printed circuit boards (PCBs) are seen in most electronic devices, but emerging applications, such as wearable electronics, vehicles with interactive interiors, and robotics, require conformable and flexible PCBs (FPCBs) [3,4]. Typically, WPCBs comprise a mixture of materials that can be grouped into nonferrous and ferrous metals and plastics and ferrous metals tend to constitute the largest proportion of WEEE in size and weight, followed by plastics [5].…”
Section: Introduction (Heading 1)mentioning
confidence: 99%