Halogen-Free Mold Compound Development for Ultra-Thin Packages

Liu, Fenny; Yao, Chuqing; Jiang, Don Son; Wang, Yu Po; Hsiao, C.S.

doi:10.1109/ectc.2007.373927

Cited by 6 publications

(1 citation statement)

References 2 publications

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“…In the present package, the small size, high-pin count and thinner type [14] of packages such as surface-mount types (SMT) [15] and ball-grid-array (BGA) [16] are preferred. These new package is also necessary to integrate the novel molding compound and the re-designed transfer-mold system.…”

Section: Discussionmentioning

confidence: 99%

Influence of plastic assembly yield with molding technology

Wang

Huang

Hsieh

et al. 2009

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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The molding technology in IC assembly is to protect the ICs avoiding the external damage and indirectly provide the heat dissipation. The molding pattern design, transfer-mold system, providing the drawing pipeline for liquid molding compound in molding is not only the technical index, but the key in the assembly throughput. Furthermore, the integrity of molding compound in plastic assembly is the main role of assembly quality. Analyzing these two factors impacting the assembly performance is the chief investigation in this work.

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Section: Discussionmentioning

confidence: 99%

Influence of plastic assembly yield with molding technology

Wang

Huang

Hsieh

et al. 2009

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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Parametric study of thermally induced warpage of FpBGA package using finite element methods

Chandana¹,

Kumar

2022

Materials Today: Proceedings

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Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds

Wei

Yang

2013

Ind. Eng. Chem. Res.

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Biphenyl epoxy/phenol-aralkyl resins with a high silica content were cured by synthesizing and using a novel organophosphine accelerator, triphenylphosphine-1,4-benzoquinone (TPP-BQ), which exhibits thermal latency. Thermal properties and curing characteristics of epoxy molding compounds (EMCs) that were accelerated by TPP-BQ and triphenylphosphine (TPP) were also studied using a differential scanning calorimeter (DSC). Although an analysis of thermal characteristics revealed that TPP-BQ is inactive at low temperatures, at high temperatures, TPP-BQ increases the curing rate of EMC in dynamic and isothermal curing experiments. Additionally, EMCs containing TPP-BQ exhibited excellent storage stability and swift hardening characteristics, owing to the effect of the thermal latency of the accelerator on the molding behavior of the EMCs. Before gelation, EMC containing TPP-BQ had a lower melting viscosity than that of EMC containing TPP, explaining why the former flowed longer in the spiral flow test than the latter.

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Halogen-Free Mold Compound Development for Ultra-Thin Packages

Cited by 6 publications

References 2 publications

Influence of plastic assembly yield with molding technology

Influence of plastic assembly yield with molding technology

Parametric study of thermally induced warpage of FpBGA package using finite element methods

Elucidating How Advanced Organophosphine Accelerators Affect Molding Compounds

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