Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Puttlitz, Karl J.; Stalter, Kathleen A.

doi:10.1201/9780203021484

Cited by 243 publications

(165 citation statements)

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“…3 Other lead-free solders deviate considerably from the Sn-Ag eutectic in attempts to improve properties or intentionally change the liquidus and solidus temperatures for one reason or another, but nearly all are Sn-based alloys containing 90%Sn or more. The prevalence of Sn in lead-free solders and its increasing importance to the electronics industry requires that significant resources be devoted to our understanding of the fundamental properties of tin as it relates to all aspects of soldering.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

Elmer

Specht

Kumar

2010

Journal of Elec Materi

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Difficult nucleation of b-Sn during solidification of tin and tin-based lead-free solder alloys can result in high degrees of undercooling of the liquid prior to solidification. The undercooling can produce solder joints with large grains, anisotropic behavior, and undesirable mechanical properties. This paper describes our examination of the amount of undercooling of tin on both graphite (non-wetting) and copper (wetting) surfaces using in situ x-ray diffraction. The microstructure was further characterized by optical microscopy, scanning electron microscopy, and electron backscattering diffraction imaging microscopy. Undercoolings as high as 61°C were observed for Sn solidified on graphite, while lower undercoolings, up to 30°C, were observed for Sn solidified on copper. The microstructure of the high purity Sn sample solidified on graphite showed very few grains in the cross-section, while the commercially pure Sn sample solidified with only one grain and was twinned. Tin solidified on copper contained significant amounts of copper in the tin, intermetallic phase formation at the interface, and a eutectic microstructure.

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Section: Introductionmentioning

confidence: 99%

Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

Elmer

Specht

Kumar

2010

Journal of Elec Materi

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“…Antimony is generally present in lead as an impurity or added in low percentage to toughen the metal. Bismuth and arsenic are generally added to the tin to prevent the reconversion from β-tin (white tin) to α-tin (gray tin, known as tin pest) [27].…”

Section: Resultsmentioning

confidence: 99%

Simultaneous and integrated neutron-based techniques for material analysis of a metallic ancient flute

Festa

Pietropaolo

Grazzi³

et al. 2013

Meas. Sci. Technol.

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A metallic 19th century flute was studied by means of integrated and simultaneous neutron-based techniques: neutron diffraction, neutron radiative capture analysis and neutron radiography. This experiment follows benchmark measurements devoted to assessing the effectiveness of a multitask beamline concept for neutron-based investigation on materials. The aim of this study is to show the potential application of the approach using multiple and integrated neutron-based techniques for musical instruments. Such samples, in the broad scenario of cultural heritage, represent an exciting research field. They may represent an interesting link between different disciplines such as nuclear physics, metallurgy and acoustics.

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“…1,2 Many Sn-based lead-free solder alloys display these problems due to large undercooling that results from the difficult nucleation of the b-Sn phase. 2 In pure Sn, undercoolings of over 100°C below its melting temperature have been observed under carefully controlled conditions, 2,3 which represents one of the highest amounts of undercooling relative to melting temperature of any elemental metal.…”

Section: Introductionmentioning

confidence: 99%

Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

Elmer

Specht

2010

Journal of Elec Materi

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The solidification behavior of two low-melting-point metals, Sn and In, on three substrates has been examined using in situ x-ray diffraction. Undercoolings of up to 56.1°C were observed for Sn solidified on graphite, which is a nonwetting substrate, while lower undercoolings were observed for Sn on Au/ Ni/Cu (17.3°C) and on Cu (10.5°C). Indium behaved quite differently, showing undercoolings of less than 4°C on all three substrates. The lattice expansion/ contraction behavior of Sn, In, and intermetallic compounds (IMCs) that formed during the reaction of Sn with Au/Ni/Cu surfaces were also measured during heating and cooling. Results showed anisotropic and nonlinear expansion of both Sn and In, with a contraction, rather than expansion, of the basal planes of In during heating. The principal IMC that formed between Sn and the Au/Ni/Cu surface was characterized as Cu 6 Sn 5 , having an average expansion coefficient of 13.6 9 10 À6 /°C, which is less than that of Sn or Cu.

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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Cited by 243 publications

References 0 publications

Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

Simultaneous and integrated neutron-based techniques for material analysis of a metallic ancient flute

Measurement of Sn and In Solidification Undercooling and Lattice Expansion Using In Situ X-Ray Diffraction

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