“…During the last decades, oxide semiconductors has been researched extensively because they provided good prospects as active materials for large area electronics due to the low temperature process ability and the superior electrical characteristics even with amorphous microstructure [1]. The backchannel etch (BCE) process in bottom gate configuration is imperative for oxide semiconductor TFTs because it provides valuable advantages such as small foot print, short channel length, less-mask and process step compared with etch-stop (ES) or other TFT structures [2]. Along with high transconductance, that is, high mobility, the capacitance in the TFT such as parasitic capacitance and channel capacitance should be kept low for high cut off frequency in the circuit application [3].…”