HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

Chen, M. H.; Cheng, C. I; Lin, Y. C.; Kao, J. C.

doi:10.23919/icep61562.2024.10535668

2024 International Conference on Electronics Packaging (ICEP) 2024

DOI: 10.23919/icep61562.2024.10535668

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HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

M. H. Chen,

C. I Cheng,

Y. C. Lin

et al.

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HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

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