HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

Pilard, Romain; Titz, Diane; Gianesello, Frédéric; Calascibetta, Pierino; Rivière, Jean-Michel; Lopez, J.; Coffy, R.; Saugier, E.; Poulain, A.; Ferrero, Fabien; Luxey, Cyril; Brachat, P.; Jacquemod, G.; Gloria, D.

doi:10.1109/aps.2012.6348633

Cited by 33 publications

(5 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“… The drawing rules and the "strip" format of fabrication of the BGA module allows automatic flip-chip assembly of the chip on the BGA. This has a capital importance considering the mass market we are targeting (5G backhaul/fronthaul links) [28]. The integration scheme is of paramount importance at mmwave frequencies [29][30][31][32].…”

Section: A F-band Antenna In Bga Packaging Technologymentioning

confidence: 99%

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Bisognin

Nachabe

Luxey

et al. 2017

IEEE Trans. Antennas Propagat.

Self Cite

View full text Add to dashboard Cite

In this paper, we propose a ball grid array (BGA) module with integrated 3D-printed plastic lens and dedicated 120 GHz OOK transceiver for 5G Backhaul/Fronthaul applications. The problem to be addressed is the following: 5G future networks will need backhaul/fronthaul 10Gbps wireless links and it's mandatory to design cost-effective and energy efficient solutions. The proposed solution is made of 3D-printed plastic lens antenna and cheap 7×7×0.362 mm 3 BGA module integrating a 2×2 array of aperture-coupled patch antennas as the source of the lens. The measurement results of the full system confirm the expected performance of the plastic lens: a-10dB matching and a 28 dBi realized gain from 114 to 140 GHz. The active measurements allows a Tx/Rx link >12Gbps data transmission with <10-6 BER at nearly 5m. This link is realized with an energy-efficiency better than 1.6 pJ/b/s which is at least 40 times better than state-ofthe-art high-speed existing TRx's. Those promising results pave the way for future cost-effective and low consumption backhaul/fronthaul systems for 5G communications. What is the novelty of your work over the existing work (100 words)? So far, several wireless links at 120 GHz have been deployed by various authors with very high Gbps speed but at the expense of high DC consumption and bulky material which is in turn correspond to weak integration of the full-system. The novelty of our work lies in the fact that every communicating block has been optimized in conjunction with all the other nearby elements, strongly taking into account cost and integration capability. Therefore a Tx/Rx link >12Gbps data transmission with <10-6 BER at nearly 5m. This link is realized with an energy-efficiency better than 1.6 pJ/b/s which is at least 40 times better than state-of-the-art high-speed existing TRx's. Provide up to three references, published or under review, (journal papers, conference papers, technical reports, etc.) done by the authors/coauthors that are closest to the present work. Upload them as supporting documents if they are under review or not available in the public domain. Enter "N.A." if it is not applicable. [1] A.

show abstract

Section: A F-band Antenna In Bga Packaging Technologymentioning

confidence: 99%

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Bisognin

Nachabe

Luxey

et al. 2017

IEEE Trans. Antennas Propagat.

Self Cite

View full text Add to dashboard Cite

show abstract

“…To achieve both high-performance and low-profile, the 3-dimensional (3-D) system-in-package (SiP) has been an attractive and efficient approach to produce MMW wireless systems [7,8,9,10]. At present, low temperature co-fired ceramic (LTCC) [11,12,13,14,15], highdensity interconnect (HDI) [16,17,18,19,20], and embedded wafer level ball grid array (eWLB) [21,22,23,24,25] have all been demonstrated for mass production of MMW SiPs. However, the selection for MMW SiP is a tradeoff among compactness, cost, electrical performance and thermo-mechanical reliability [26].…”

Section: Introductionmentioning

confidence: 99%

Si-based system-in-package design with broadband interconnection for E-band applications

Chu

Zhou

et al. 2021

IEICE Electron. Express

View full text Add to dashboard Cite

This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radiofrequency (RF) interconnection from carrier board to the die is carefully designed based on the impedance transformation characteristic of the transmission line (TL). In addition, the simulation results show that the designed interconnection is robust to moderate process deviations. To verify the electrical performance of the designed interconnection, a dummy testing structure is designed, fabricated and measured. The measurement results show that the return loss is less than −10.6 dB in the commercial communication frequency range of 71-86 GHz for E-band applications.

show abstract

“…The antenna-inpackage (AiP) solution has received great attention with the advantages of compactness, low cost, high reproducibility, and reliability [5]. Particularly, various antenna arrays have been demonstrated for the mm-wave band using high-temperature cofired ceramics (HTCC) [6], low temperature cofired ceramics (LTCC) [7], and high-density interconnect (HDI) [8] technologies using low-loss organic substrates.…”

Section: Introductionmentioning

confidence: 99%

28/38 GHz Dual-band Dual-polarized Highly Isolated Antenna for 5G Phased Array Applications

Chu

Zhu

Liao

et al. 2019

2019 IEEE MTT-S International Wireless Symposium (IWS)

View full text Add to dashboard Cite

This paper proposed a new dual-band dual-polarized array antenna operating at 28 GHz and 38 GHz for 5G communication applications. Three stacked patches are adopted to achieve the dual-band operation. The lower band from 27.48 to 28.50 GHz is achieved by using the lower large patch, which is couple-fed by the middle patch. While the upper band from 36.94 to 40.43 GHz is achieved by using the middle and upper patches. The two patches resonant at 38 and 40 GHz respectively and the two resonant modes coupled together, which greatly enhances the upper band. To increase the polarization isolation in the lower band, a shorting pin connecting the lower patch and ground is utilized. Taking advantages of the multi-layer technology, the position of the vertical feeding probe between the middle patch and lower patch is slightly shifted to ensure the good impedance matching in both lower band and upper band. For the antenna element, the simulated-12 dB bandwidths are 27.48-28.50 GHz and 36.94-40.43 GHz for the two bands, respectively. The in-band gains are over 6 dBi in the lower band, and over 4 dBi in the upper band. For the 2×2 antenna array, the isolations are better than 20 dB in both bands.

show abstract

HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution

Cited by 33 publications

References 6 publications

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Ball Grid Array Module With Integrated Shaped Lens for 5G Backhaul/Fronthaul Communications in F-Band

Si-based system-in-package design with broadband interconnection for E-band applications

28/38 GHz Dual-band Dual-polarized Highly Isolated Antenna for 5G Phased Array Applications

Contact Info

Product

Resources

About