Heat accumulation in microdrilled glass from ultraviolet laser ablation

Hidai, Hirofumi; Matsusaka, Satoshi; Chibá, Akira; Morita, Noboru

doi:10.1007/s00339-015-9196-y

Cited by 13 publications

(6 citation statements)

References 29 publications

(46 reference statements)

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“…Glass modifications have been reported by different approaches including drilling with a Bessel beam [13] and using a CO 2 laser [14]. Very-high aspect ratio holes can be achieved using UV technologies [15][16][17]. However, a huge potential has been predicted for GHz-burst micromachining in dielectrics in a recent review [18], and very recently, first results have been reported on percussion drilling in dielectrics [19].…”

Section: Introductionmentioning

confidence: 99%

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Balage

Lopez

Bonamis

et al. 2022

Int. J. Extrem. Manuf.

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We report novel results on top-down percussion drilling in different glasses with femtosecond laser GHz-bursts. Thanks to this particular regime of light-matter interaction, combining non-linear absorption and thermal cumulative effects, we obtained crack-free holes of aspect ratios exceeding 30 in sodalime and 70 in fused silica. The results are discussed in terms of inner wall morphology, aspect ratio and drilling speed.

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Section: Introductionmentioning

confidence: 99%

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Balage

Lopez

Bonamis

et al. 2022

Int. J. Extrem. Manuf.

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“…We have previously investigated deep micro drilling in glass using ultraviolet lasers [16][17][18]. In these experiments, the inner surface reflection of the hole enables deep drilling.…”

Section: Introductionmentioning

confidence: 99%

Curved drilling via inner hole laser reflection

Hidai

Kuroki

Matsusaka

et al. 2016

Precision Engineering

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In this paper, we describe curved hole drilling via the reflection of a laser beam off the sidewall of the drilled hole. A slightly offset laser beam forms a tilted surface at the bottom of the hole, controlling the angle of curvature. An ultraviolet laser beam operating at a wavelength of 266 nm was used. To visualize the hole formation process, borosilicate glass was used as the laser workpiece. This method was able to drill a curved hole with an average angle of ~3° with curvature beginning at a depth of 400-600 µm. A curved hole with a diameter of < 50 µm was achieved. A branched hole was also demonstrated by using the reflection of the tilted sidewall. The curved hole formation process was recorded with a high speed camera. Once the ablated sidewall reached a certain depth, drilling ceased as the laser energy fell below the ablation threshold. Ultimately, judicious selection of an appropriate laser fluence and sidewall angle allow the formation of curved holes.

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“…The modification mechanism may be considered as follows. First, the fluence where the emission was observed was 2.9 mJ/cm 2 under the beam focused in the glass at a depth of 1100 μm with an absorption coefficient of 90 cm −1 , spot diameter of 7.3 μm (Hidai, et al, 2015a) (same as the calculated beam spot diameter), and reflection at the glass surface of 3.5%. This value is much smaller than that observed for silica glass ablation (Demos, et.…”

Section: Discussionmentioning

confidence: 91%

“…The experimental apparatus was similar to that described in our previous reports (Hidai, et. al., 2015a, Hidai, et.…”

Section: Methodsmentioning

confidence: 96%

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Modification of borosilicate glass induced by ultraviolet laser illumination

Hidai

Matusaka

Chibá

et al. 2016

Mechanical Engineering Letters

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There have been many investigations into the changes in the properties of transparent materials, e.g. optical, physical and chemical properties, induced by focused ultrafast laser beams. In this letter, we report the modification of borosilicate glass using an ultraviolet nanosecond laser. A laser beam operating at a wavelength of 266 nm was focused inside the glass. Interestingly, although penetration depth of the laser beam was only 110 μm, emission was observed in the glass at the depth of approximately 1100 μm after several laser shots. The emission moved toward the light source with further laser illumination, and modification of the glass along the trajectory of the emission was observed. The modified area became deeper with increasing focusing depth. The deepest modified area was located at a depth of approximately 1800 μm. No clear dependence of the modification on the pulse repetition rate was found; therefore, heat accumulation was not prominent in the modification process. The subsequent etching rate of the modified area was faster than that of the unmodified area. The etching rate in aqueous KOH was 60 μm/h where continuous modification was obtained. A microchannel with a depth of approximately 400 μm and a diameter of approximately 30 μm was formed after 10 h etching.

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Heat accumulation in microdrilled glass from ultraviolet laser ablation

Cited by 13 publications

References 29 publications

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Crack-free high-aspect ratio holes in glasses by top–down percussion drilling with infrared femtosecond laser GHz-bursts

Curved drilling via inner hole laser reflection

Modification of borosilicate glass induced by ultraviolet laser illumination

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