2019
DOI: 10.1002/adfm.201806030
|View full text |Cite
|
Sign up to set email alerts
|

Heat‐Assisted Photoacidic Oxidation Method for Tailoring the Surface Chemistry of Polymer Dielectrics for Low‐Power Organic Soft Electronics

Abstract: The use in low-power soft electronics of the appropriate insulating polymer materials with a high dielectric constant (k) is considered a practical alternative to that of inorganic dielectric materials, which are brittle and have high processing temperatures. However, the polar surfaces of typical high-k polymer insulators are problematic. Further, it is a huge challenge to control their surface properties without damage because of their soft and chemically fragile nature. Here, a heat-assisted photoacidic oxi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

1
13
0

Year Published

2019
2019
2024
2024

Publication Types

Select...
9

Relationship

2
7

Authors

Journals

citations
Cited by 14 publications
(14 citation statements)
references
References 52 publications
1
13
0
Order By: Relevance
“…The relatively hydrophobic c PVP surface (water contact angle, 78.6°) transformed into a hydrophilic surface (water contact angle, ∼20.5°) through the UV/ozone treatment because of the introduction of hydroxyl groups (Figure S3). The selective-wetting method was employed to pattern the MXene electrodes over a large area. The substrate was immersed in MXene aqueous solution and then carefully pulled out at a constant speed.…”
Section: Results and Discussionmentioning
confidence: 99%
“…The relatively hydrophobic c PVP surface (water contact angle, 78.6°) transformed into a hydrophilic surface (water contact angle, ∼20.5°) through the UV/ozone treatment because of the introduction of hydroxyl groups (Figure S3). The selective-wetting method was employed to pattern the MXene electrodes over a large area. The substrate was immersed in MXene aqueous solution and then carefully pulled out at a constant speed.…”
Section: Results and Discussionmentioning
confidence: 99%
“…17−19 The surface energy, which represents the sum of the polar and dispersion components that result from the presence of permanent and instantaneous dipoles, respectively, was adjusted by the chemical functionality and packing density of the SAM interlayers. 17,18,20 For instance, nonpolar or poorly interacting moieties mostly provide lower surface energies. Figure 2 shows the obtained surface energies of dielectrics variously functionalized using CF 3 , CH 3 , NH 2 , SH, and Cl.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…16−22 Many research groups have illustrated that the surface functionalities of a gate dielectric with small semiconducting molecules modulate device electrical performance. 17,20,23,24 Hydrophobic surface modification in the gate dielectrics can, for instance, enhance the crystalline properties and the molecular ordering of organic active layers to facilitate charge transport along the π−π overlap direction and to prevent trap formation by polar functionalities at the interface. 17,18,23,24 Such studies related to controlling the surface functionalities have also revealed the influence of surface properties on the performance of FET devices fabricated with a polymer-based organic semiconducting active layer.…”
Section: ■ Introductionmentioning
confidence: 99%
“…OFET device operation depends on the interface structures between the active layer and the dielectric surface, because charge carrier transport between the source and drain electrodes mainly occurs in the channel region, within a few nanometers of the active layer near the dielectric surface. 42,43 We analyzed the 15 nm PDQDB film to highlight differences between the interface structures as a function of the thermal post-processing temperature. The prepared PDQDB thin film spontaneously separated in liquid nitrogen via instant cooling due to differences in the thermal expansion coefficients of the SiO 2 /Si substrate and the polymer film.…”
Section: ■ Results and Discussionmentioning
confidence: 99%