2018
DOI: 10.1016/j.ijheatmasstransfer.2018.01.056
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Heat conduction investigation of the functionally graded materials plates with variable gradient parameters under exponential heat source load

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Cited by 15 publications
(13 citation statements)
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“…The boundary integral equation based upon this approach has been solved numerically using a Galerkin approximation. The hybrid numerical method, based on the weighed residual and Fourier transform methods, to investigate the temperature distribution in the FGM plates under the exponential heat source load, was adopted by Tian and Jiang [ 17 ].…”
Section: Introductionmentioning
confidence: 99%
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“…The boundary integral equation based upon this approach has been solved numerically using a Galerkin approximation. The hybrid numerical method, based on the weighed residual and Fourier transform methods, to investigate the temperature distribution in the FGM plates under the exponential heat source load, was adopted by Tian and Jiang [ 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…The multi-layered model has been developed for analysis of the two-dimensional sliding frictional contact problem with a functionally graded coating [ 28 ]. This model has been used to solve the transient heat conduction and thermal stress problems for the FGM plate taking into consideration temperature-dependent material properties [ 17 ].…”
Section: Introductionmentioning
confidence: 99%
“…This work has followed earlier studies that have shown the heat conduction of functionally graded structures with H(t) and exp(t). 19,20 heat source using hybrid numerical method, and its correctness has been verified by Liu and Xi 21 but the linear heat source is not mentioned. The purpose of this work is to explore the heat conduction of FGM with variable gradient parameters under the linear heat source.…”
Section: Introductionmentioning
confidence: 99%
“…Extension to the study of Functionally Graded Materials (FGM) properties might also be interesting as FGM are often designed to be used in severe temperature environment, under high thermal and mechanical loads [11].…”
Section: Introductionmentioning
confidence: 99%