Heat dissipation design and optimization of high-power LED lamps

Zou, Yong; XIA, Yuhang; Ren, Hui; Zhang, Chuancheng; Wang, Miaomiao; Xu-Bing, Tang; Ding, Shoujun

doi:10.1016/j.tsep.2022.101587

Cited by 8 publications

(2 citation statements)

References 13 publications

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“…The dissolution of aluminum was ruled out as the reason for the solidification of the liquid metal in the previous section because of several reasons: (1) The solidification took place on all samples, namely, titanium alloy samples, titanium alloy samples protected by diamond, and Si samples protected by diamond/graphite. The latter does not have aluminum as a constituent.…”

Section: The Origin Of the Solidification Of The Liquid Metal?mentioning

confidence: 99%

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Long-Term Corrosion of Eutectic Gallium, Indium, and Tin (EGaInSn) Interfacing with Diamond

Handschuh-Wang,

Wang,

Zhang

et al. 2024

Materials

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Thermal transport is of grave importance in many high-value applications. Heat dissipation can be improved by utilizing liquid metals as thermal interface materials. Yet, liquid metals exhibit corrosivity towards many metals used for heat sinks, such as aluminum, and other electrical devices (i.e., copper). The compatibility of the liquid metal with the heat sink or device material as well as its long-term stability are important performance variables for thermal management systems. Herein, the compatibility of the liquid metal Galinstan, a eutectic alloy of gallium, indium, and tin, with diamond coatings and the stability of the liquid metal in this environment are scrutinized. The liquid metal did not penetrate the diamond coating nor corrode it. However, the liquid metal solidified with the progression of time, starting from the second year. After 4 years of aging, the liquid metal on all samples solidified, which cannot be explained by the dissolution of aluminum from the titanium alloy. In contrast, the solidification arose from oxidation by oxygen, followed by hydrolysis to GaOOH due to the humidity in the air. The hydrolysis led to dealloying, where In and Sn remained an alloy while Ga separated as GaOOH. This hydrolysis has implications for many devices based on gallium alloys and should be considered during the design phase of liquid metal-enabled products.

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Section: The Origin Of the Solidification Of The Liquid Metal?mentioning

confidence: 99%

“…High-performance computing, high-power light sources, and communication devices, such as wireless communications, are examples of devices necessitating advanced heat dissipation [ 1 ]. Heat accumulation in these devices degrades their performance and may shorten their lifespan [ 2 ].…”

Section: Introductionmentioning

confidence: 99%