2021
DOI: 10.1016/j.jeurceramsoc.2020.12.005
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Heat dissipation in 3D printed cellular aluminum nitride structures

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Cited by 20 publications
(7 citation statements)
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“…The specimen section varies between 25 Â 25 and 40 Â 40 mm 2 , thus, similar to those used in TPS. Regarding additively manufactured 3D ceramic structures, to the best of the authors knowledge, there are no experimental works analysing their thermal conductivities, although comparative evaluations of the heat dissipation capability of different printed materials during cooling have recently been addressed [19][20][21][22].…”
Section: Thermal Conductivity Methodsmentioning
confidence: 99%
“…The specimen section varies between 25 Â 25 and 40 Â 40 mm 2 , thus, similar to those used in TPS. Regarding additively manufactured 3D ceramic structures, to the best of the authors knowledge, there are no experimental works analysing their thermal conductivities, although comparative evaluations of the heat dissipation capability of different printed materials during cooling have recently been addressed [19][20][21][22].…”
Section: Thermal Conductivity Methodsmentioning
confidence: 99%
“…The final products obtained by low-pressure spark plasma sintering (LPSPS) exhibited a solid density above 97% of theoretical density (TD) and a linear shrinkage of only ∼22.8%. The same multi-additive system used for SiC in reference [ 31 ] allows printing other ceramics like silicon nitride (Si 3 N 4 ) [ 57 ], aluminum nitride (AlN) [ 58 ] and robust architectured graphene/SiC [ 59 ].…”
Section: Optimization Of Ink Formulation and Sintering Process For Ro...mentioning
confidence: 99%
“…Thus, suitable additives must be chosen. Hydroxypropyl methylcellulose and polyethyleneimine have been extensively used as viscosifying and coagulant agents, respectively [64, 65, 75,80,81]. Also, a variety of commercial dispersants have been employed, depending on the selected ceramic powder.…”
Section: Direct Ink Writingmentioning
confidence: 99%