Heat-release package design and analysis of high-power white LED down light

Heat Dissipation Simulation Research of LED Downlight and Optimization of Light Source Layout

“…Chen and etc [7] established a compact-thermal model for LED package under different boundary conditions derived based on temperature and heat flow calculated by the detail finite volume model. The finite element method modeling for simulating the LED package with different heat slug, PCB, cooling condition and chip size are conducted in [8].The results are the thermal design rules and correlations for industry new LED lamp products development.Bai and etc [9] used CFD software for thermal simulation of a 3 core white LED downlight, analysised the material thermal resistance of thermal transverse channels such as substrate, solder, copper foil, aluminum substrate, etc;then a hybrid rapid thermal channel method which using copper to connect PN junction and external radiator is presented for heat dissipation optimization design of LED downlight.Ma [10] used finite element method to analysis and calculate temperature field of a 15W LED downlight,further heat dissipation effect analysis of PCB thermal conductivity, thermal rubber heat conductivity and chips position(relative to the radiator fin type) were all taken in considered. This paper will system analysis LED downlights dissipation of the relevant factors, such as power load, thermal resistence, material emissive, light source layout, etc.The research will be carried out mainly based on CFD software thermal simulation and experimental measurement.…”