Heat transfer enhancement by coated fins in the microscale domain

Thanigaivelan, R.; Deepa, D

doi:10.2298/tsci160901089t

Cited by 8 publications

(4 citation statements)

References 14 publications

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“…The experiments are carried out with the help of auto transformer, ammeter, voltmeter and heating element. Heating element is kept at the bottom of the test pieces and constant 12 Watts power supply was given to the specimen and readings were taken for every one hour [10][11][12]. The specimen is totally covered with insulating material and heat will be added from the bottom side of the test piece.…”

Section: Methodsmentioning

confidence: 99%

A Comparative Study of Natural Convective Transfer in Rectangular and Square Geometry Micro Fins

Deepa¹,

Thanigaivelan²,

Gunasekaran³

et al. 2021

IJES

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The increase in usage of high performance micro-electronic components leads to increase in high heat generation. In order to increase the life time of the electron devices proper ventilation of heat needs to be planned with the available space. In the electronic system the space occupied by the heat sink is small, as well as the heat has to be dissipated without disturbance. There are two types of cooling arrangement namely active cooling and passive cooling. Active cooling requires additional system such as blower and fan over passive cooling. In this study rectangular and square fin micro-fins are fabricated on copper and aluminium for a height of 0.25mm, with spacing and thickness of 5mm to study the natural convective heat transfer. The study reveals that the rectangular geometry enhances the heat transfer rate by 3% compared to the square fin.

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Section: Methodsmentioning

confidence: 99%

A Comparative Study of Natural Convective Transfer in Rectangular and Square Geometry Micro Fins

Deepa¹,

Thanigaivelan²,

Gunasekaran³

et al. 2021

IJES

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“…When using parallel flow, the change in heat sink performance that occurs as the number of slides increases is not proportional to the substantial rise in pumping power [7]. When compared to the aluminium test piece, the paint coated copper test piece produces a 20.62% higher heat transfer and the convective heat transfer rate increased by 49% when comparing the aluminium with the aluminium paint coated test piece [8]. The heat transfer coefficients of different cross sections were investigated using an experimental investigation with a helical coil heat exchanger and the combination of Ethylene glycol and water improves heat transfer efficiency by 10 to 15% and lowers heat loss from the pipe [9].…”

Section: Introductionmentioning

confidence: 99%

The 3-D computational investigation of thermal performance on engine cylinder: Effect of different geometry fins

Ayyakkannu¹,

Chandramurthy

Veeramalai³

et al. 2023

THERM SCI

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A fin is a surface that extends from an object to increase the rate of heat transfer to or from the environment for enhancing convection. The heat transfer performance of the engine cylinder fin is investigated in this study using fin geometries with various extensions, including rectangular, trapezium, and triangular segmental extensions. These are compared to fins without extension and showed a 5-13% increase in heat transfer rate. The primary idea behind adding extensions to finned surfaces is to increase the surface area of the fin in contact with the fluid/coolant flowing around it, resulting in a faster heat transfer rate.

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“…Sivasankaran et al [2] in their study performed experimental and theoretical analysis on parallel plate heat sinks with optimum fan distance. Thanigaivelan et al [3] investigated micro heat sinks with different material and coatings. Many researchers focused on geometrical design of mini-channels to enhance the heat transfer rate.…”

Section: Introductionmentioning

confidence: 99%

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

et al. 2020

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Original scientific paper https://doi.org/10.2298/TSCI180722022AWater cooled heat sinks are becoming popular due to increased heat generation inside the microprocessor. Timely heat removal from microprocessor is the key factor for better performance and long life. Heat transfer enhancement is reached either by increasing the surface area density and/or by altering the base fluid properties. Nanoparticles emerge as a strong candidate to increase the thermal conductivity of base fluids. In this research, the thermal performance of mini-channel heat sinks for different fin spacing (0.2 mm, 0.5 mm, 1 mm, and 1.5 mm) was investigated numerically using CuO-water nanofluids with volumetric concentration of 1.5%. The numerical values computed were than compared with the literature and a close agreement is achieved. We recorded the minimum base temperature of chip to be 36.8 °C for 0.2 mm fin spacing heat sink. A reduction of 9.1% in base temperature was noticed using CuO-water nanofluids for 0.2 mm fin spacing as compared to previously experimental estimated value using water [1]. The drop percentage difference in pressure between water and CuO-water nanofluids was 2.2-13.1% for various fin spacing heat sinks. The percentage difference in thermal resistance between water and CuO-water nanofluids was computed 12.1% at maximum flow rate. We also observed uniform temperature distribution for all heat sinks.

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Heat transfer enhancement by coated fins in the microscale domain

Cited by 8 publications

References 14 publications

A Comparative Study of Natural Convective Transfer in Rectangular and Square Geometry Micro Fins

A Comparative Study of Natural Convective Transfer in Rectangular and Square Geometry Micro Fins

The 3-D computational investigation of thermal performance on engine cylinder: Effect of different geometry fins

Numerical study for heat transfer enhancement using CuO water nanofluids through mini-channel heat sinks for microprocessor cooling

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