Heat transfer enhancement by flexible printed circuit board's deformation

Lim, Chong Hooi; Abdullah, M. Z.; Azid, Ishak Abdul; Khor, C. Y.

doi:10.1016/j.icheatmasstransfer.2017.04.004

Cited by 9 publications

(12 citation statements)

References 17 publications

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“…The optimum numbers of grid for fluid and structural domain are 41,972 and 29,256, respectively, as the results variation between Test C and Test D, Test G and Test H are insignificant and accuracy are high. In fact these results were presented by Lim et al (2017d).…”

Section: Grid Independency Testmentioning

confidence: 75%

“…In the analysis, flow induced force, film temperature and heat transfer coefficient on FPCB were exported from FLUENT to ABAQUS while structural deformation and temperature of the FPCB assembly (consist of FPCB and BGA packages) were transmitted from ABAQUS to FLUENT. Indeed the present method was same as the one used by Lim et al (2017d), in which the effect of thermal and flow has been coupled simultaneously in the simulation. The grid independency test has been presented by Lim et al (2017d) while the numerical results were validated in good agreement with the experimental findings (Lim et al, 2017b(Lim et al, , 2017d.…”

Section: Modelling Toolsmentioning

confidence: 99%

“…Indeed the present method was same as the one used by Lim et al (2017d), in which the effect of thermal and flow has been coupled simultaneously in the simulation. The grid independency test has been presented by Lim et al (2017d) while the numerical results were validated in good agreement with the experimental findings (Lim et al, 2017b(Lim et al, , 2017d. Beside, similar simulation approaches had been used in the integrated circuit encapsulation investigation (Khor et al, 2012), FPCB's idle state study (Lim et al, 2017c) and wave soldering process analysis (Abdul Aziz et al, 2015).…”

Section: Modelling Toolsmentioning

confidence: 99%

“…However, these studies were restrained to air flow effects without considering the thermal effects and the electronic components were replaced by dummy Perspex blocks for simplification. Later on, Lim et al (2017d) further explored the investigation on FPCB by considering both flow and thermal effects simultaneously.…”

Section: Introductionmentioning

confidence: 99%

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Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Lim

Abdullah

Azid

et al. 2020

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Purpose The purpose of this study is to investigate heat transfer and deformation of flexible printed circuit board (FPCB) under thermal and flow effects by using fluid structure interaction. This study simulate the electronic cooling process when electronic devices are generating heat during operation at FPCB under force convection. Design/methodology/approach The thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated in the simulation. Effects of Reynolds number (Re), number of BGA packages attached, power supplied to the BGA packages and size of FPCB were studied. The responses in the present study are the deflection/length of FPCB (δ/L) and Nusselt number (Nu). Findings It is important to consider both thermal and flow effects at the same time for understanding the characteristic of FPCB attached with BGA under operating condition. Empirical correlation equations of Re, Prandtl number (Pr), δ/L and Nu have been established, in which the highest effect is of Re, followed by Pr and δ/L. The δ/L and Nu¯ were found to be significantly affected by most of the parametric factors. Practical implications This study provides a better understanding of the process control in FPCB assembly. Originality/value This study provides fundamental guidelines and references for the thermal coupling modelling to address reliability issues in FPCB design. It also increases the understanding of FPCB and BGA joint issues to achieve high reliability in microelectronic design.

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Section: Grid Independency Testmentioning

confidence: 75%

Section: Modelling Toolsmentioning

confidence: 99%

Section: Modelling Toolsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Lim

Abdullah

Azid

et al. 2020

Self Cite

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show abstract

“…The study found that when the area of convection grows, the temperature of the FPCB decreases, and the current-carrying capacity of the FPCB's tracks increases. Even though the author (Lim et al, 2020(Lim et al, , 2017b(Lim et al, , 2017d was able to demonstrate that thermal effect is more remarkable than flow effect in his previous studies, as shown in Table 1, the balance between the Re and the Nu must be maintained to minimize the d /L and stress. This is the reason for using respond surface method (RSM) optimization in this study.…”

Section: Introductionmentioning

confidence: 99%

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Lim

Abdullah

Aziz

et al. 2021

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Purpose This study aims to investigate the interaction of independent variables [Reynolds number (Re), thermal power and the number of ball grid array (BGA) packages] and the relation of the variables with the responses [Nusselt number ((Nu) ¯ ), deflection/FPCB’s length (d/L) and von Mises stress]. The airflow and thermal effects were considered for optimizing the Re of various numbers of BGA packages with thermal power attached on flexible printed circuit board (FPCB) for optimum cooling performance with least deflection and stress by using the response surface method (RSM). Design/methodology/approach Flow and thermal effects on FPCB with heat source generated in the BGA packages have been examined in the simulation. The interactive relationship between factors (i.e. Re, thermal power and number of BGA packages) and responses (i.e. deflection over FPCB length ratio, stress and average Nusselt number) were analysed using analysis of variance. RSM was used to optimize the Re for the different number of BGA packages attached to the FPCB. Findings It is important to understand the behaviour of FPCB when exposed to both flow and thermal effects simultaneously under the operating conditions. Maximum d/L and von Misses stress were significantly affected by all parametric factors whilst (Nu)¯ is significantly affected by Re and thermal power. Optimized Re for 1–3 BGA packages with maximum thermal power applied has been identified as 21,364, 23,858 and 29,367, respectively. Practical implications This analysis offers a better interpretation of the parameter control in FPCB with optimized Re for the use of force convection electronic cooling. Optimal Re could be used as a reference in the thermal management aspect in designing the BGA package. Originality/value This research presents the parameters’ effects on the reliability and heat transfer in FPCB design. It also presents a method to optimize Re for the different number of BGA packages attached to increase the reliability in FPCB’s design.

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Fluid-solid-thermal coupling analysis of rock failure under the joint action of cutting and jet impingement

Dai

Huang

et al. 2021

Geothermics

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Heat transfer enhancement by flexible printed circuit board's deformation

Cited by 9 publications

References 17 publications

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Heat transfer and deformation analysis of flexible printed circuit board under thermal and flow effects

Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology

Fluid-solid-thermal coupling analysis of rock failure under the joint action of cutting and jet impingement

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