Heat transfer modeling for surface crack depth evaluation

Streza, M.; Fedala, Y.; Roger, J.P.; Tessier, Gilles; Boué, C.

doi:10.1088/0957-0233/24/4/045602

Cited by 32 publications

(22 citation statements)

References 12 publications

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“…The validation of COMSOL's heat transfer modules is documented in different studies. [15][16][17] A typical COMSOL simulation comprises of choosing the physics and solver type, defining geometry and materials, applying appropriate boundary conditions and meshes.…”

Section: Computational Proceduresmentioning

confidence: 99%

Thermal depth profiling of materials for defect detection using hot disk technique

et al. 2016

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A novel application of the hot disk transient plane source technique is described. The new application yields the thermal conductivity of materials as a function of the thermal penetration depth which opens up opportunities in nondestructive testing of inhomogeneous materials. The system uses the hot disk sensor placed on the material surface to create a time varying temperature field. The thermal conductivity is then deduced from temperature evolution of the sensor, whereas the probing depth (the distance the heat front advanced away from the source) is related to the product of measurement time and thermal diffusivity. The presence of inhomogeneity in the structure is manifested in thermal conductivity versus probing depth plot. Such a plot for homogeneous materials provides fairly constant value. The deviation from the homogeneous curve caused by defects in the structure is used for inhomogeneity detection. The size and location of the defect in the structure determines the sensitivity and possibility of detection. In addition, a complementary finite element numerical simulation through COMSOL Multiphysics is employed to solve the heat transfer equation. Temperature field profile of a model material is obtained from these simulations. The average rise in temperature of the heat source is calculated and used to demonstrate the effect of the presence of inhomogeneity in the system.

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Section: Computational Proceduresmentioning

confidence: 99%

Thermal depth profiling of materials for defect detection using hot disk technique

et al. 2016

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“…However, the test validation is generally compulsory. [30][31][32] This paper presents the experimental investigation and FEA model to simulate the thermal phenomena in IRT for evaluation of subsurface defect size and depth. A reference STS 304 specimen with known artificial defects of flat bottomed holes of different size and depth was used for the analysis.…”

Section: Introductionmentioning

confidence: 99%

Investigation of lock-in infrared thermography for evaluation of subsurface defects size and depth

Shrestha

Kang

Kim

2015

Int. J. Precis. Eng. Manuf.

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In this study, the investigation on lock-in infrared thermography was done for the detection and estimation of artificial subsurface defects size and depth in stainless steel sample. The experimental and the finite element analysis were performed at several excitation frequencies to interrogate the sample ranging from 0.182 down to 0.021 Hz. A finite element model using 'ANSYS 14.0' was used to completely simulate the lock-in thermography. The four point method was used in post processing of every pixel of thermal images using the MATLAB programming language. A signal to noise ratio analysis was performed on both phase and amplitude images in each excitation frequency to determine the optimum frequency. The relationship of the phase value with respect to excitation frequency and defect depths was examined. Amplitude image was quantitatively analyzed using Vision Assistant, a special tool in LABVIEW program to acquire the defects size. The phase image was used to calculate the defects depth considering the thermal diffusivity of the material and the excitation frequency for which the defects become visible. A finite element analysis result was found to have good correlation with experimental result and thus demonstrated potentiality in quantification of subsurface defects.

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“…The application of computational techniques, such as finite differences for pulsed or modulated thermography [2], or continuous finite element method (FEM) for lock-in thermography [3], provides a complementary tool for crack characterization and detection. Continuous FEM requires a fine meshing of the cracked domain, dramatically increasing the number of degrees of freedom and therefore the computational time.…”

Section: Introductionmentioning

confidence: 99%

Finite element model for crack characterization by lock - in thermography inspection

Celorrio¹,

Omella²

2014

Proceedings of the 2014 International Conference on Quantitative InfraRed Thermography

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In this work, a discontinuous Galerkin finite element method, for a discontinuous transmission problem, is proposed to model the thermal wave scattering in lock-in thermographic inspection of cracked opaque samples with general inner cracks. Unlike continuous finite element methods, the model we present does not require meshing of the gaps within the cracks, radically reducing the amount of degrees of freedom and the elapsed time spent during the simulation. We will focus on analyzing the sensitivity of the temperature propagation through the crack under different parameters such as length, depth, thermal resistance of finite cracks and parameters involving the modulated laser excitation.

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Heat transfer modeling for surface crack depth evaluation

Cited by 32 publications

References 12 publications

Thermal depth profiling of materials for defect detection using hot disk technique

Thermal depth profiling of materials for defect detection using hot disk technique

Investigation of lock-in infrared thermography for evaluation of subsurface defects size and depth

Finite element model for crack characterization by lock - in thermography inspection

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