Heat transfer of micro-droplet during free fall in drop tube

Freezing Shrinkage Dynamics and Surface Dendritic Growth of Floating Refractory Alloy Droplets in Outer Space

“…where u is the fluid velocity, p is the fluid pressure, and μ is the fluid viscosity. Fluid heat transfer is described by the heat transfer equation and Fourier's law of heat transfer: [40,41] 𝜌C p 𝜕T 𝜕t…”

“…The N–S equation and the continuity equation in this study can be expressed as: [ 39 ] $$$$\begin{equation}\nabla \cdot {\bm{u}} = 0\end{equation}$$$$ $$$$\begin{equation} - \nabla {\bm{p}} + \nabla \cdot \left( {\mu \left( {\nabla {\bm{u}} + {{{(\nabla {\bm{u}})}}^T}} \right)} \right) = 0\end{equation}$$$$where u is the fluid velocity, p is the fluid pressure, and µ is the fluid viscosity. Fluid heat transfer is described by the heat transfer equation and Fourier's law of heat transfer: [ 40,41 ] $$$$\begin{equation}\rho {{C}_p}\frac{{\partial T}}{{\partial t}} + \rho {{C}_p}{\bm{u}} \cdot \nabla T + \nabla \cdot {\bm{q}} = Q + {{Q}_p} + {{Q}_{{\mathrm{vd}}}}\end{equation}$$$$ $$$$\begin{equation}{\bm{q}} = - \kappa \nabla T\end{equation}$$$$where κ is the thermal conductivity of the liquid, q is the heat flux and C p is the specific heat at constant pressure. Q is the external heat source, Q p is the pressure work and Q vd is the viscous heat dissipation.…”

Critical undercooling of growth mode transition in undercooled Al-80%Si-1.0%P alloy

“…However, obtaining large undercooling effects is challenging under traditional conditions. Electromagnetic levitation (EML) is a suitable technique for achieving an undercooled state [6][7][8]. As a typical rapid solidification technology, the EML has been applied to investigate the solidification behavioural characteristics of semiconductors [9][10][11].…”

A Calorimetric Study Assisted with First Principle Calculations of Specific Heat for Si-Ge Alloys within a Broad Temperature Range

“…[1−3] The study of specific heat facilitates the commercial applications related to the physical characteristics in at least three aspects: (1) thermal management, which has been a primary challenge to electronics; [4] (2) novel semiconductor materials design, various applications have been put forward different requirements for thermophysical properties; [5,6] (3) fundamental researches, the reliable specific heat data is necessary to thermal physics and semiconductor physics, including heat transfer and thermodynamics. [7,8] Accordingly, an in-depth knowledge of specific heat is of great importance in both industrial applications and scientific research for semiconductor materials. Si, Ge and their alloys play irreplaceable roles in semiconductor industries.…”