2015
DOI: 10.1016/j.ijheatmasstransfer.2014.10.066
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Heat transfer of twin-fin piezofan at various orientations and buoyancy levels

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Cited by 1 publication
(2 citation statements)
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“…Dey and Chakrborty (2009) reported the enhancement of convective cooling using oscillating fins. More studies and application can be found on a literature review of Maaspuro (2016) and recent researches (Li et al, 2013;Li and Wu., 2016;Wait et al, 2007;Chang et al, 2015;Kota and Mukherjee., 2018) on enhancement of convective cooling by piezo fans (Li et al, 2013), thermal management of electronics and LEDs cooled by dual piezoelectric fans (Li and Wu, 2016), thermal performance of plate-fin heat sinks using higher flexural modes (Wait et al, 2007), twin-fin piezo fan at various orientations and buoyancy levels (Chang et al, 2015) and randomness of system parameters (Kota and Mukherjee, 2018). Fatehi et al (2019) worked on boundary condition problems in density-based smoothed particle hydrodynamics methods for incompressible flows by MATLAB (2010).…”
Section: Paper Type Research Papermentioning
confidence: 99%
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“…Dey and Chakrborty (2009) reported the enhancement of convective cooling using oscillating fins. More studies and application can be found on a literature review of Maaspuro (2016) and recent researches (Li et al, 2013;Li and Wu., 2016;Wait et al, 2007;Chang et al, 2015;Kota and Mukherjee., 2018) on enhancement of convective cooling by piezo fans (Li et al, 2013), thermal management of electronics and LEDs cooled by dual piezoelectric fans (Li and Wu, 2016), thermal performance of plate-fin heat sinks using higher flexural modes (Wait et al, 2007), twin-fin piezo fan at various orientations and buoyancy levels (Chang et al, 2015) and randomness of system parameters (Kota and Mukherjee, 2018). Fatehi et al (2019) worked on boundary condition problems in density-based smoothed particle hydrodynamics methods for incompressible flows by MATLAB (2010).…”
Section: Paper Type Research Papermentioning
confidence: 99%
“…Heat removal in an enclosure is interested field of study in many engineering and industrial uses, such as heat pipes (Singh et al , 2013), headlamp for automotive (Remsburg, 1998; Singh et al , 2014; Jamalabadi et al , 2012; Abdollahzadeh Jamalabadi et al , 2013; Abdollahzadeh Jamalabadi, 2014a; Abdollahzadeh Jamalabadi, 2014b; Jamalabadi, 2015; Abdollahzadeh Jamalabadi and Dousti, 2016; Gholamalizadeh et al , 2017; Abdollahzadeh Jamalabadi et al , 2017; Jamalabadi, 2017), radiative furnaces (Jamalabadi et al , 2012; Abdollahzadeh Jamalabadi et al , 2013; Abdollahzadeh Jamalabadi, 2014a), lubrication technologies (Jamalabadi, 2015; Jamalabadi, 2017), thermal storage systems (Abdollahzadeh Jamalabadi and Dousti, 2016; Gholamalizadeh et al , 2017; Abdollahzadeh Jamalabadi et al , 2017; Jamalabadi, 2017; Yorinaga et al , 1985; Acikalin et al , 2004a; Acikalin et al , 2004b), solar collectors (Bejan, 1984) and thermal management of aviation in high speed aircrafts (Chapra and Canale, 1988), thermal design of building (Shadloo, 2019; Sadeghi et al , 2018; Sadeghi and Shadloo, 2017; Sadeghi et al , 2016; Hopp-Hirschler et al , 2019), polymer process (Hopp-Hirschler et al , 2018; Nasiri et al , 2018; Shadloo et al , 2016), air conditioning (Rahmat et al , 2014; Fatehi et al , 2014; Shadloo et al , 2013), drying technologies equipment (Karlin et al , 1998; Ghia et al , 1982; Toda, 1979; Sheu et al , 2008) and heat removal from electronic devices (Yoo et al , 2000; Liu et al , 2009, 2013; Kimber and Garimella, 2009; Kimber et al , 2009; Ma et al , 2012; Yao and Uchino., 2001; Sufian et al , 2013; Wu and Ro., 2005; Dey and Chakrborty., 2009; Maaspuro, 2016; Li et al , 2013; Li and Wu., 2016; Wait et al , 2007; Chang et al , 2015; Kota and Mukherjee, 2018), chemical processing (…”
Section: Introductionmentioning
confidence: 99%