Heat transfer study of 3D packaging structure with superconducting TSV for practical-scale quantum annealing machines
Wei Feng,
Katsuya Kikuchi
Abstract:To avoid the interconnect crowding in a planar structure, three-dimensional (3D) integrated technologies are necessary for realizing practical large-scale quantum annealing (QA) machines. We studied the heat transfer of a 3D packaging structure with superconducting through-silicon via for large-scale QA machines by finite element method simulation. The heat transfer becomes less efficient in the stacked structure. A high temperature of 57.0 mK is observed for the qubit chip, which degrades the quantum coherenc… Show more
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