Heat Treatment Effect on the Creep of Industrial Copper Wire

Abstract

<p class="Default">Creep behavior of copper wire, produced by wiredrawing process in ENICAB Biskra, has been investigated by creep tests at 340°C under the stress 98,108 and 118 MPa. In this investigation, three samples have been tested: copper drawn wire non heat treated, and heat treated at 600°C and 700°C. Microstructure after the creep test was observed by optical microscopy to understand the rupture mechanism. We have found that the sample heat treated at 600 °C had a longer creep life. We have also deduced that the dislocation creep was the creep deformation mechanism of the drawn copper. SEM observations of fractured surfaces after creep tests of drawn copper wire non heat treated and treated 10 min at 600 ° C under stress of 118 MPa.</p>

Creep and hardening behavior of 6101 aluminum alloy manufactured by wiredrawing process

“…Based on our results, the increase of the aging time induces a ductile rupture during a creep test of the aluminum alloy. Consequently, our findings are in agreement with the investigation of Beniwal et al (2010), performed on pure aluminum wire and also are in agreement with our previous work of the rupture mechanism by creep test of heat treated drawn copper wire (Gareh and Boumerzoug, 2016).…”