Heats pipes for temperature homogenization: A literature review

Abstract

Heat pipes offer high effective heat transfer in a purely passive way. Other specific properties of heat pipes, like temperature homogenization, can be also reached. In this paper, a literature review is carried out in order to investigate the existing heat pipe systems mainly aiming the reduction of temperature gradients. The review gathering more than sixty references is sorted into various application fields, like thermal management of electronics, of storage vessels or of satellites, for which the management of the temperature uniformity differs by the isothermal surface area, temperature ranges or the targeted precision of the temperature flattening. A summary of heat pipe characteristics for this function of temperature homogenization is then performed to identify their specificities, compared to other applications of heat pipes.

Theoretical and experimental analysis of a horizontal planar Liquid-Vapour Thermal Diode (PLVTD)

“…Inadvertent wetting of Plate 2 during reverse mode operation will facilitate latent heat transfer that will undermine the insulation performance and significantly diminish the diodicity. Thermal diodes are well suited to electronics cooling applications Chen, 2011 &Chen et al, 2012;Blet et al, 2017;Avanessian and Hwang, 2018;Traipattanakul et al, 2019;Wong et al, 2019), solar collector applications (De Beijer, 1998;Quinlan, 2010;Souliotis et al, 2011&2017;Smyth et al, 2015a&b, 2017Smyth et al, 2015a&b, , 2018Smyth et al, 2015a&b, , 2019Pugsley et al, 2016;Pugsley, 2017;Muhumuza et al, 2019a & b), climate control building envelopes (Chen et al, 1998;Varga, 2002;Reay et al, 2014;Villeneuve et al, 2017), and permafrost stabilisation applications (Pan and Wu, 2002;Pei et al, 2017). Applications in spacecraft (Gaddam and Huxtable, 2017) and caloric refrigeration systems (Hess et al, 2019), and thermal computing (Tso and Chao, 2016;Shen et al, 2018) have also been proposed.…”

Experimental Study on Heat Transfer Enhancement of Phase Change Material using Embedded Oscillating Heat Pipe for Thermal Energy Storage

“…The working fluid in heat pipe evaporates at the evaporation section and condenses at the condensation section. 34) Driven by the heat source, the working fluid starts to evaporate at the evaporation section and flows to the condensation section. After cooling at the condensation section, the working fluid flows back to the evaporation section based on gravity or capillary force.…”

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation

“…Such high heat fluxes cannot be addressed by using conventional cooling solutions such as vapor chamber [7]- [8], and single-phase liquid cooling [9]- [12]. Vapor chamber in combination with forced convection could dissipate heat flux no more than 100 W/cm 2 [13], while single-phase liquid cooling could reach 350 W/cm 2 [14]- [16]. Recently, immersion pool boiling and liquid metal cooling schemes have been reported for high heat flux electronics [13], [18]- [20].…”

“…Vapor chamber in combination with forced convection could dissipate heat flux no more than 100 W/cm 2 [13], while single-phase liquid cooling could reach 350 W/cm 2 [14]- [16]. Recently, immersion pool boiling and liquid metal cooling schemes have been reported for high heat flux electronics [13], [18]- [20]. The immersion pool boiling, which requires dielectric fluid to be in contact with the ICs directly, is usually limited by the critical heat flux of dielectric fluid and thus has insufficient cooling capacity.…”