2011 IEEE 24th International Conference on Micro Electro Mechanical Systems 2011
DOI: 10.1109/memsys.2011.5734435
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Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level

Abstract: This paper reports a novel room temperature hermetic liquid sealing process based on wire bonded "plugs" over the access ports of liquid-filled cavities. The method enables liquids to be integrated already at the fabrication stage. Test vehicles were manufactured and used to investigate the mechanical and hermetic properties of the seals. A helium leak rate of better than 10 −10 mbarL/s was measured on the successfully sealed structures. The bond strength of the "plugs" were similar to standard wire bonds on f… Show more

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Cited by 8 publications
(9 citation statements)
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“…This detection system can be used in micro-electromechanical systems (MEMS) devices and biomedical applications for traceable flow rates as low as 1 L/min. Antelius, et al (2011) used another vacuum system to detect leaks as small as 1.4 × 10 −8 Pa L/s (hole diameter 24 m, noise level of the detector 1 × 10 −8 Pa L/s) in a MEMS-based hermetic liquid integration device fabricated on a silicon wafer. Depending on the detection method used, finding the exact location of a leak may be difficult.…”
Section: Types Of Leakage Testingmentioning
confidence: 99%
“…This detection system can be used in micro-electromechanical systems (MEMS) devices and biomedical applications for traceable flow rates as low as 1 L/min. Antelius, et al (2011) used another vacuum system to detect leaks as small as 1.4 × 10 −8 Pa L/s (hole diameter 24 m, noise level of the detector 1 × 10 −8 Pa L/s) in a MEMS-based hermetic liquid integration device fabricated on a silicon wafer. Depending on the detection method used, finding the exact location of a leak may be difficult.…”
Section: Types Of Leakage Testingmentioning
confidence: 99%
“…This can be accomplished by fabricating and hermetically sealing the component in an inert environment. In this regard, advancements for the packaging of MEMS components can potentially be leveraged [66,67].…”
Section: Commercialization Issuesmentioning
confidence: 99%
“…Recently, MEMS devices encapsulating liquid inside have been developed, which exploits unique characteristics of liquids that are deformable and can form spherical shape due to the surface tension [31][32][33][34][35]. Liquid encapsulation processes have also been developed, including deposition of parylene directly onto nonvolatile liquid [31], bonding-in-liquid technique (BiLT) [33][34][35], and sealing with gold wire [36].…”
Section: Introductionmentioning
confidence: 99%