Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Qiang; Lorenz, Norbert; Cannon, K. M.; Wang, Changhai; Moore, Andrew J.; Hand, Duncan Paul

doi:10.2351/1.5061370

Cited by 2 publications

(1 citation statement)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This type of process is referred to as bombing. The sample is then placed in the helium leak detector to measure the leak rate of the helium from the cavity [16,17]. For encapsulated packages, according to the MIL-STD-883G specification, the maximum leak rate allowable is 5 x 10 -8 atm cm 3 /s [3].…”

Section: Hermeticity Testingmentioning

confidence: 99%

Glass frit hermetic encapsulation for harsh environment multi-chip module application

Lim¹

View full text Add to dashboard Cite

CHAPTER 4: RESULTS & DISCUSSION 4.1 Characterisation of AGC glass frit 4.1.1 DSC characterisation of AGC glass frit 4.1.2 XRD characterization of AGC glass frit 4.1.3 EDS performed on glass frit 4.1.4 TGA characterization of AGC glass frit 4.1.5 Fracture toughness of AGC glass frit 4.1.6 Flexural strength of AGC glass frit 4.1.7 X-Ray inspection on Al 2 O 3 to Al 2 O 3 bonding using glass frit 4.2 Shear strength of glass frit bonding under thermal aging 4.2.1 SEM image of thermal aged samples 4.2.2 Room temperature shear and hot temperature shear of thermal aged samples 4.2.3 SEM image of the surface of shear fractured samples 4.3 Helium leak test of glass frit bonded ceramic package under thermal aging 43 4.3.1 X-Ray inspection on ceramic package using glass frit bonding 4.3.2 Helium leak rate of ceramic package under thermal aging 4.3.2.1 Helium leak rate result of glass frit paste apply on encapsulation lid 4.3.2.2 Helium leak rate result of glass frit paste apply on both encapsulation lid and substrate 4.3.3 Difference in glass frit applied on single side and double side 4.3.3.1 SEM image of glass frit applied on single side and double side 4.3.3.2 Shear strength of glass frit applied on single side and double side Glass Frit Hermetic Encapsulation for Harsh Environment Multi-Chip Module Application Lim Jun Zhang v CHAPTER 5: SIMULATION 49 5.1 ANSYS TM simulation of package encapsulated with glass frit 49 5.1.1 Effect of hydrostatic pressure on the package 50 5.1.2 Effect of hydrostatic pressure on package with different glass frit thickness 53 5.1.3 Effect of hydrostatic pressure on package with a thicker encapsualtion lid 57 CHAPTER 6: CONCLUSION 59 CHAPTER 7: FUTURE WORK 61 Average 58.970 Standard Deviation 3.175

show abstract

Section: Hermeticity Testingmentioning

confidence: 99%

Glass frit hermetic encapsulation for harsh environment multi-chip module application

Lim¹

View full text Add to dashboard Cite

show abstract

Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation

Tsai

Huang

et al. 2021

IEEE Trans. Electron Devices

View full text Add to dashboard Cite

Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Cited by 2 publications

References 17 publications

Glass frit hermetic encapsulation for harsh environment multi-chip module application

Glass frit hermetic encapsulation for harsh environment multi-chip module application

Investigation of Metal Interconnect for Wafer-Level and Sealable Miniaturized MEMS Encapsulation

Contact Info

Product

Resources

About