Hermetic Test Procedures and Standards for Semiconductor Electronics

Abstract

The hermetic testing of semiconductor devices is a challenging subject area because of the need for leak testing large numbers of sealed packages to very fine leak rates, where the packages are of a wide range of materials and internal volumes. The types of measurement methods to be discussed are those presently in use and are represented in both military and voluntary standards. Four of these methods will be assessed briefly along with the relevant standards as to advantages, disadvantages, range, precision, and agreement. The four methods are bubble, weight gain, helium leak detector, and radioisotope test procedures. Present interlaboratory test efforts that have been undertaken to provide suitable test data for guidance in the drafting of new American Society for Testing and Materials (ASTM) standards will be summarized. Future directions will be indicated.

Nondestructive tests used to insure the integrity of semiconductor devices, with emphasis on acousticemission techniques

“…Such cracks are shown in Figure 39. The upper lead cracked at 5 gf and was further stressed to 10 gf with no additional AE . The lower lead was stressed at 4 gf and cracked.…”

“…There are a number of methods such as bubble, dye, weight gain, halogen leak detection, helium leak detection, and radioisotope leak detection. These have been critically reviewed by Ruthberg [10] and the following treatment is derived from his. There are variations on the methods of performing each test.…”