We propose and demonstrate Ga 2 O 3 metal-oxide-semiconductor field-effect transistors (MOSFETs) on a high thermal conductivity AlN/Si substrate to improve the heat dissipation capability and keep their cost-effectiveness. Owing to the optimized source/drain contact and Al 2 O 3 /Ga 2 O 3 interface, a drain current of 580 mA/mm and peak intrinsic transconductance G m,int of 35.5 mS/mm were achieved, which are among the highest for all the reported top-gate Ga 2 O 3 MOSFETs. A peak mobility of 82.9 cm 2 /V•s, a high saturation velocity v sat of 1.1 × 10 7 cm/s, and a low interface trap density of 1.1 × 10 12 cm −2 eV −1 are also obtained. Pulse measurement reveals the good heat dissipation capability of the AlN/Si substrate. A three terminal off-state breakdown voltage V br of 118 V, a small specific on resistance R on,sp of 1.44 m •cm 2 , and power figure-of-merit of 9.7 MW/cm 2 are achieved in a device with L GD of 1.14 μm. These excellent results indicate the great potential of Ga 2 O 3 MOSFETs on AlN/Si substrate for future power electronics applications. INDEX TERMS Ga 2 O 3 , MOSFETs, AlN/Si, self-heating effect.