Hierarchical simulation of substrate coupling in mixed-signal ICs considering the power supply network

Brandtner, T.; Weigel, R.

doi:10.1109/date.2002.998426

Cited by 4 publications

(5 citation statements)

References 4 publications

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“…This simplified model and its mathematical treatment have been presented in [5]. However, this model can be extended to oxide layers, which makes it possible to define non-conducting layers like SOI layers inside the bulk.…”

Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

“…and may be determined by an algorithm based on the FastHankel-Transform similar to the one presented in [5], but with σ replaced by κ. Several different algorithms have been proposed in literature to solve (3) in subquadratic time.…”

Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

“…A presentation of a simplified model for substrate coupling simulation has been given in [5] based on the assumption that the substrate consists of different conductive layers with conductivity σ. This approach can be extended to non-conductive oxide layers by introducing a generalized complex conductivity κ = σ + jωε (1) This leads to a quasi-electrostatic current flow problem between certain contacts that is expressed mathematically by the Poisson equation…”

Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

“…The basic approach and several measurement results for verification in 0.13 µm CMOS and 0.25 µm BiCMOS technologies have been published in [5,6]. The tool exploits the boundary element method (BEM) and contains a Poisson solver based on an O(n) conjugate gradient algorithm [7].…”

Section: Introductionmentioning

confidence: 99%

“…The tool exploits the boundary element method (BEM) and contains a Poisson solver based on an O(n) conjugate gradient algorithm [7]. In addition, it offers the opportunity to consider the influence of the impedance of the power supply network defined by a SPICE netlist [5]. In Sect.…”

Section: Introductionmentioning

confidence: 99%

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SubCALM: a program for hierarchical substrate coupling simulation on floorplan level

Brandtner¹,

Weigel²

Proceedings Design, Automation and Test in Europe Conference and Exhibition

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The hierarchical substrate coupling simulation tool Sub-CALM offers the opportunity to estimate substrate coupling on floorplan level. A novel approach for modeling well and SOI structures in a boundary element description is introduced. Several acceleration techniques like precalculated macromodels and sophisticated preconditioning algorithms are presented which are applied to an O(n)-conjugate-gradient Poisson solver in order to be able to process large full-chip layouts during floorplanning.

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Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

Section: Combined Substrate and Oxide Layer Modelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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