High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating

Liu, Ming; Liu, Jianguo; Zeng, Xiaoyan; Du, Qifeng; Ai, Jun

doi:10.1016/j.apsusc.2015.07.046

Cited by 18 publications

(9 citation statements)

References 23 publications

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“…The top and the bottom of To prove the autocatalytic activity of MoO 3 , the experiments designed before were used, 27 which included putting the MoO 3 powder directly into the ECP solution for observation. If copper…”

Section: Methodsmentioning

confidence: 99%

“…On the other hand, these laser activators have the catalytic activity to induce the following ECP or convert to elemental metals to induce ECP under the action of lasers. According to the literature and previous studies, typical laser activators includes palladium compounds, 27 copper hydroxyl phosphate, 22 antimony-doped tin oxide (ATO), 28 copper aluminate (CuAl 2 O 4 ), 29 organic copper [CuC 2 O 4 , Cu(acac) 2 ], 1 ethylene diamine tetra-acetic acid (EDTA)−Cu, 30 copper chromium oxide (CuO•Cr 2 O 3 ), 31 and aluminum oxide (Al 2 O 3 ). 25 In the industrial field, the laser used for LISM basically refers to the 1060−1070 nm (known as 1064 nm) nearinfrared (NIR) laser, and therefore, the past developments and applications were almost all for the 1060−1070 nm NIR laser.…”

Section: Introductionmentioning

confidence: 99%

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Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Feng

Xiao

et al. 2022

ACS Appl. Mater. Interfaces

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In laser-induced selective metallization (LISM), conventional laser activators only work at a single laser wavelength. This study reported a new laser activator (MoO3) very suitable for both 355 nm UV and 1064 nm near-infrared (NIR) lasers for the first time. When applying MoO3 to polymers, the prepared Cu layer on laser-activated polymers showed a good conductivity (2.63 × 106 Ω–1·m–1) and excellent adhesion. Scanning electron microscopy, optical microscopy, and resistance analysis revealed the excellent LISM performance of the polymer/MoO3 composites, and the quality of the Cu layer prepared using the UV laser is much better than that using the NIR laser. The limit width of the copper wire prepared by the UV laser is as narrow as 30.1 μm. We also confirmed the mechanism of MoO3 initiating electroless copper plating after laser activation to be the autocatalytic mechanism, which is very different from the conventional reduction mechanism. The effect of laser activation was only to expose the MoO3 active species to the polymer surface. X-ray diffraction and tube experiments revealed that the activity of α·h-MoO3 was higher than that of α-MoO3. X-ray photoelectron spectroscopy indicated that a part of Mo6+ was reduced to Mo5+ during laser activations, leading to the increase of the oxygen vacancies in MoO3 and possibly further enhancing the activity of MoO3. Besides, the micro-rough structures caused by the laser on the polymer surface provided riveting points for successfully depositing the copper layer. The Ni–Cu, Ag–Cu, and Au–Ni–Cu layers were obtained via the continued deposit of other metals on the Cu layer. The resistances of these metal layers had much better stability than that of the neat Cu layer. Furthermore, the Au layer further enhanced the conductivity of the circuit. The proposed strategy is easy for large-scale industrial applications, which will greatly expand the application scenarios of the LISM field.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Feng

Xiao

et al. 2022

ACS Appl. Mater. Interfaces

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“…Moreover, pulsed radiation offers more parameters to be controlled with high precision (such as repetition rate, pulse energy, etc. ), which makes fine tuning the processing conditions possible [ 42 , 43 , 44 , 45 ]. The features of the deposition process and the parameters affecting its efficiency have been studied; the importance of surface pre-activation of the acceptor substrate, with the laser-induced microplasma technique [ 46 , 47 ], has also been highlighted and analyzed.…”

Section: Introductionmentioning

confidence: 99%

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

et al. 2022

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In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass substrates and optional laser post-processing of the recorded structures; thus, the proposed approach offers a complete manufacturing cycle, utilizing a single, commercially available, pulsed Yb fiber laser system. The potential implications of the presented research are amplified by the observation of laser-induced periodic surface structures (LIPSSs) that may be useful for the further tuning of tracks’ functional properties.

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“… 16 However, the porous Cu layer deposited on the laser patterned plastic does not have well-defined metal/plastic boundary. 17 Therefore, the thickness of the deposited Cu layer cannot be characterized by known techniques: atomic force microscopy, stylus profilometry, ellipsometry, interferometry, etc. Moreover, the specific electrical conductance of the autocatalytic deposition of Cu film might be up to 10 times lower than of bulk.…”

Section: Introductionmentioning

confidence: 99%

Percolation effect of a Cu layer on a MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating

et al. 2018

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High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating

Cited by 18 publications

References 23 publications

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Autocatalytic Laser Activator for Both UV and NIR Lasers: Preparation of Circuits on Polymer Substrates by Selective Metallization

Direct Laser Writing of Copper Micropatterns from Deep Eutectic Solvents Using Pulsed near-IR Radiation

Percolation effect of a Cu layer on a MWCNT/PP nanocomposite substrate after laser direct structuring and autocatalytic plating

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