High-barrier polyimide containing fluorenol moiety: Gas barrier properties and molecular simulations

Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power

“…High water vapor transmission rate (WVTR) will reduce the adhesive strength or reliability of the film. 5,21 The WVTR values of S-PI-500 Å- y films were also verified in this work, and the results were listed in Table 1. The WVTR of the original PI substrate is about 242.9 g-mil/m 2 -day.…”

“…1–4 Colorless polyimide (PI) has been regarded as the preferred material for flexible transparent panels because of its high optical transmittance, high thermal stability, low dielectric constant, and excellent resistance to chemical solvents. 3–7 However, the circuit patterns deposited on colorless PI substrates would be visible to the naked eye. Therefore, an anti-reflective (AR) layer is often fabricated between colorless PI and electronic circuits to hide the electronic circuits.…”

Atomic layer deposition in advanced display technologies: from photoluminescence to encapsulation

“…Solution-based methods include spin-coating and inkjet printing. Unfortunately, the polymer layers fabricated using these methods are known to exhibit poor gas-diffusion barrier properties owing to their high polymeric porosities [13][14][15]. However, ALD is a relatively low temperature process that provides a high film quality for the preparation of luminescent materials and their corresponding devices [16][17][18].…”

Ultra‐highTgand ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction

“…Therefore, further improvement of T g and reduction of CTE have become hot research topics in the field of PI film materials. [13][14][15][16][17][18][19][20][21][22] Previous studies have shown that the intrinsic method, i.e., designing the molecular chain structure of PI, has the most obvious effect on the increase of T g and reduction of CTE. [23][24][25] Yang et al prepared a series of PI films with pyridine and pyrimidine structures.…”