High-density convergent plasma sputtering device for a liquid metal target using an unheated glass plate

Abstract

A high-density convergent plasma sputtering device has been developed for a liquid metal target, using an unheated glass plate. The convergent magnetic field lines, which are produced by an external solenoid coil and a permanent magnet positioned behind the liquid metal target, effectively transport high-density plasmas near the target. In this study, a liquid gallium target was sputtered with nitrogen plasmas, without additive gas required for depositing gallium nitride films on the unheated substrates. The deposition rate of the GaN film was estimated at ∼13 nm/min at a gas pressure of 0.2 Pa. A strong diffraction peak was observed along the GaN (002) axis, with the use of an unheated glass plate and a target-substrate distance of ∼45 mm.

Potential of High-density Convergent Plasma Sputtering Device for Magnetic Film Deposition

“…This plasma sputtering device can be used irrespective of the state of the target material such as magnetic or liquid states [9]. In this study, the discharge characteristics of Ar plasmas are shown.…”