High Density Microwave Packaging Technology Development for Department of Defense Applications

Lamb, Franklin; Paul, B.C.; Lesniak, C.

doi:10.1007/978-1-4899-1480-4_5

Directions for the Next Generation of MMIC Devices and Systems 1997

DOI: 10.1007/978-1-4899-1480-4_5

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High Density Microwave Packaging Technology Development for Department of Defense Applications

Franklin Lamb¹,

B.C. Paul²,

C. Lesniak³

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High Density Microwave Packaging Technology Development for Department of Defense Applications

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