High Density Multi-Channel Passively Aligned Optical Probe for Testing of Photonic Integrated Circuits

Leijtens, X.J.M.; Santos, R.; Williams, Kevin

doi:10.1109/jphot.2020.3045346

Cited by 5 publications

(3 citation statements)

References 24 publications

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“…A good demonstrator would be a multi-channel optical switch that needs high-density optical interconnects and electrical interconnects. We will utilize the passive optical alignment method for high-density optical interconnects reported in [32] and [33], which has been demonstrated to achieve interconnect density of 40 channels. Edge coupling is adopted between fiber arrays, waveguides on a SiN-based TriPleX carrier and waveguides on a flipped InP die.…”

Section: Discussionmentioning

confidence: 99%

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confidence: 99%

“…High-density optical interconnects have been studied previously based on a passive optical alignment [32], [33]. This technique has been demonstrated to achieve interconnect density of 40 channels per mm and provides ± 2 µm alignment tolerance within 0.5 dB [32]. The passive optical alignment technique is not the subject of this paper, but compatible with this flip-chip bonding concept with laser soldering.…”

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Flip-Chip Bonding of InP Die on SiN-Based TriPleX Carrier With Novel Laser Soldering

Tian

Beste

Khachikyan

et al. 2023

IEEE J. Quantum Electron.

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