Abstract:As high-performance, compact semiconductor devices approach physical limitations on the number of input and output pins, board designers increasingly rely on microvias to fan out signals in facilitating board layout. These highly compact and high-density designs are driving microvias with even more closely-packed, smaller-diameter holes and thinner traces. One such embedded computer system used in aerospace applications has 17,018 microvias. Acceptance Testing (AT) criteria includes environmental stresses to e… Show more
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