High Density Vertical Probe Card Fabrication with Low Cost and High Precision Characteristics by Using MEMS Process

Huang, Jung-Tang; Lin, Chung-Yi; Lai, Wen-Shiung; Chao, Pen-Shan; Shih, Sheng-Hsiung

doi:10.1109/eptc.2005.1614376

Cited by 5 publications

(2 citation statements)

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“…There have been several attempts to use a metal structure such as nickel (Ni) [5,6], nickel-tungsten (Ni-W) [9,10], nickel-manganese (Ni-Mn) [12], nickel-iron (Ni-Fe) [13] or nickel-cobalt (Ni-Co) [10,14,15] as the material of the probe structure in order to give a high degree of hardness and yield stress. Nickel electroplating has been fully developed for microfabrication with deep x-ray lithography known as LIGA (a German acronym for LIthographie, Galvanoformung and Abformung) [14], but its hardness is about Hv200 (Vickers Hardness which is also known as Diamond Pyramid Hardness).…”

Section: Designmentioning

confidence: 99%

“…Moreover, it is difficult to electroplate nickel-manganese and nickel-iron up to hundreds of microns and to have a high degree of hardness compared to nickel-cobalt. Therefore, the best material up to now is a nickel-cobalt alloy since it can be easily electroplated and has a high yield stress and hardness [10,15]. The probe card can consistently provide a path resistance of less than 5 and has greatly reduced parasitic capacitances.…”

Section: Designmentioning

confidence: 99%

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Design and fabrication of a highly manufacturable MEMS probe card for high speed testing

Kim

Kim²

2008

J. Micromech. Microeng.

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We have designed and fabricated a micro-electro mechanical system (MEMS) probe card, which is suitable for a manufactured product, to achieve a deflection of 50 µm at a force of 1.5 gram (g) and a probe structure height of 720 µm. The cantilever structure consists of a tip and beam of Ni-Co, a bump of Ni and AuSn solder between them. In order to make the probe card compliant, all moving structures such as the tip, beam and bumps were electroplated with nickel, nickel-cobalt and gold solutions. The fabricated MEMS probe card can endure more than 150 µm overdrive and prevent tip damage from particles owing mainly to its high bump height and enhanced high frequency test, putting capacitors between the driving voltage and ground. Based on our experimental results, the average contact force was approximately 1.41 gram force (gf) at 50 µm of deflection and the total path resistance was less than 5 for all pins, while the leakage current was less than 5 nA.

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