High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

Cui, Mengya; Huang, Ting; Peng, Zeyu; Xing, Lingrong; Zhou, Zheng; Guo, Liang; Wang, Jianli; Xu, Jingwei; Xiao, Rongshi

doi:10.1002/admt.202201610

Cited by 9 publications

(2 citation statements)

References 46 publications

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“…[121,156,159] Also depending on the photosensitizer, SPA can be responsible for laser-induced reduction. [161] Alternatively, the use of laser systems with lower photon flux (e.g., laser with higher PW and CW laser) for reduction relies on photothermal activation of formulations made from the metal ion and reducing agents. The thermal stimulus and decomposition of reducing agents or solvents promote the necessary electron transfer and subsequent reduction of the metal ions, leading to the nucleation of nanostructures at the irradiated surface.…”

Section: Laser-induced Reductionmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

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Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost‐effective, high‐resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, we survey and outline recent advances and strategies based on DLW for electronics microfabrication, based on laser material growth strategies. First, we summarize the main DLW parameters influencing material synthesis and transformation mechanisms, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser‐induced graphene, and their mixtures. By accessing a wide range of material types, DLW‐based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next‐generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.This article is protected by copyright. All rights reserved

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Section: Laser-induced Reductionmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

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show abstract

“…Flexible electronics have attracted growing attention in diverse fields such as industry, medicine, and commerce. − Conductive structures are essential for integrating various functional parts such as sensors, detectors, and controllers into electronic systems. − The integration and miniaturization of flexible electronics pose an increased requirement for the conductivity and stability of these structures.…”

Section: Introductionmentioning

confidence: 99%

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Zhou

Guo

Sun

et al. 2023

ACS Appl. Electron. Mater.

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Bimetallic Cu−Ag conductive structures hold great promise in integrating flexible electronics, but fabrication of these structures requires complex multistep processes with poor controllability. Herein, we develop a one-step laser writing process for manufacturing the flexible Cu−Ag conductive structure from a metallic salt. The effect of laser parameters and precursor traits on the writing process, as well as the joining mechanism of Cu−Ag nanostructures, has been discussed systematically. The fabricated Cu−Ag structure not only exhibits remarkable conductivity with a resistivity of ∼8 μΩ cm but also has excellent oxidation and electrochemical migration resistances. Flexible electronic devices fabricated from these written structures, such as the flexible heater, were demonstrated as a proof of concept, thereby demonstrating excellent stability even in high-humidity-and-temperature working conditions.

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Localized in-situ deposition: a new dimension to control in fabricating surface micro/nano structures via ultrafast laser ablation

Fan,

Jiang,

et al. 2023

Front. Optoelectron.

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Controllable fabrication of surface micro/nano structures is the key to realizing surface functionalization for various applications. As a versatile approach, ultrafast laser ablation has been widely studied for surface micro/nano structuring. Increasing research efforts in this field have been devoted to gaining more control over the fabrication processes to meet the increasing need for creation of complex structures. In this paper, we focus on the in-situ deposition process following the plasma formation under ultrafast laser ablation. From an overview perspective, we firstly summarize the different roles that plasma plumes, from pulsed laser ablation of solids, play in different laser processing approaches. Then, the distinctive in-situ deposition process within surface micro/nano structuring is highlighted. Our experimental work demonstrated that the in-situ deposition during ultrafast laser surface structuring can be controlled as a localized micro-additive process to pile up secondary ordered structures, through which a unique kind of hierarchical structure with fort-like bodies sitting on top of micro cone arrays were fabricated as a showcase. The revealed laser-matter interaction mechanism can be inspiring for the development of new ultrafast laser fabrication approaches, adding a new dimension and more flexibility in controlling the fabrication of functional surface micro/nano structures. Graphical Abstract

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High‐Efficiency and Low‐Intensity Threshold Femtosecond Laser Direct Writing of Precise Metallic Micropatterns on Transparent Substrate

Cited by 9 publications

References 46 publications

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Laser Writing of Cu–Ag Alloy Flexible Electrodes with Excellent Oxidation and Electrochemical Migration Resistances

Localized in-situ deposition: a new dimension to control in fabricating surface micro/nano structures via ultrafast laser ablation

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