High-Efficiency Cells From Layer Transfer: A First Step Toward Thin-Film/Wafer Hybrid Silicon Technologies

Brendel, Rolf; Petermann, J.; Zielke, Dimitri; Schulte‐Huxel, Henning; Kessler, M.; Gatz, Sebastian; Eidelloth, S.; Bock, Robert; Rojas, Enrique Garralaga; Schmidt, Jan; Dullweber, Thorsten

doi:10.1109/jphotov.2011.2165529

Cited by 24 publications

(12 citation statements)

References 21 publications

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“…This is the case of the HySi concept proposed by ISFH [2], the i 2 -module concept proposed by IMEC [3], the XIS concept proposed by ECN [4], and other similar industrial prototypes [5]- [7]. The devices that are suggested in these concepts are fabricated according to the following flow.…”

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confidence: 99%

“…As such, the foils are processed into solar cells while being mechanically supported during the majority of the process steps; this way, most handling issues are solved. Furthermore, several foils can be bonded to the same module glass and part of the processing can be realized at module level (module-level processing) [2], [8]- [11]. This way, the module throughput can be significantly increased and, if the process after bonding is maintained simple, the production cost is decreased.…”

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confidence: 99%

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Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Granata¹,

Aleman²,

Bearda³

et al. 2014

IEEE J. Photovoltaics

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Future wafer-based silicon solar cells will be fabricated on thin (<140 μm) wafers. However, technologies to handle thin wafers during cell processing are not yet available for industry. In this paper, a flow to handle thin wafers during rear side cell processing is developed and demonstrated on 4-in 200 μm-thick wafers. The flow involves bonding the wafers to glass after frontside processing followed by a low-temperature p-n heterojunction formation on the rear side. 2.5 × 2.5 cm 2 amorphous/crystalline silicon heterojunction interdigitated back-contact solar cells are fabricated by use of lithography while bonded to glass, and they show an efficiency of up to 17.7%. Shunts, infrared light absorption, and rear side interface passivation are identified as the main efficiency losses. Dedicated experiments suggest that the passivation losses are related to the degradation of the adhesive during wafer cleaning. Hence, methods to improve the compatibility of the adhesive with the cleaning process are discussed. Index Terms-Heterojunction silicon solar cells, interdigitatedback-contact (i-BC), superstrate processing.

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confidence: 99%

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confidence: 99%

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Granata¹,

Aleman²,

Bearda³

et al. 2014

IEEE J. Photovoltaics

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“…39 Due to the simultaneous processing this concept allows the application of cost-effective thin film processes at module level. The approach was developed particularly for the processing of very thin absorbers, as the rigid substrate gives an additional mechanical support during the front side processing.…”

Section: Integration Of Memo-bilayers Into Photovoltaic Systemsmentioning

confidence: 99%

Kerfless exfoliated thin crystalline Si wafers with Al metallization layers for solar cells

et al. 2015

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We report on a kerfless exfoliation approach to further reduce the costs of crystalline silicon photovoltaics making use of evaporated Al as a double functional layer. The Al serves as the stress inducing element to drive the exfoliation process and can be maintained as a rear contacting layer in the solar cell after exfoliation. The 50-70 lm thick exfoliated Si layers show effective minority carrier lifetimes around 180 ls with diffusion lengths of 10 times the layer thickness. We analyze the thermo-mechanical properties of the Al layer by x-ray diffraction analysis and investigate its influence on the exfoliation process. We evaluate the approach for the implementation into solar cell production by determining processing limits and estimating cost advantages of a possible solar cell design route. The Al-Si bilayers are mechanically stable under processing conditions and exhibit a moderate cost savings potential of 3-36% compared to other c-Si cell concepts.

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“…Thin wafers are more flexible and fragile than thick wafers, and keener to break. An increased breakage rate can have a negative impact on the manufacturing yield and, for this reason, solutions to handle thin wafers safely during processing are currently being investigated . Among them, a widely adopted method is the bonding of the thin wafer to a thick substrate at an early stage of the cell processing.…”

Section: Introductionmentioning

confidence: 99%

Role of O₂radicals on silicone plasma treatments for a-Si:H surface passivation of PV wafers bonded to glass

Granata

Marchegiani

Bearda

et al. 2015

Phys. Status Solidi A

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Argon (Ar) and oxygen (O 2 ) plasmas are performed on silicone adhesives to eliminate the negative influence of silicone on amorphous silicon (a-Si:H) surface passivation of wafers bonded to glass. Both the Ar and O 2 plasmas lead to oxidation of the silicone surface, consisting in an increase of oxygen/ carbon ratio, of degree of crosslinking, and of material density. The oxidized silicone is more resilient than pristine and does not interact with the a-Si:H passivation process, allowing for state-of-the-art surface passivation of wafers bonded to glass.

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High-Efficiency Cells From Layer Transfer: A First Step Toward Thin-Film/Wafer Hybrid Silicon Technologies

Cited by 24 publications

References 21 publications

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Kerfless exfoliated thin crystalline Si wafers with Al metallization layers for solar cells

Role of O₂radicals on silicone plasma treatments for a-Si:H surface passivation of PV wafers bonded to glass

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High-Efficiency Cells From Layer Transfer: A First Step Toward Thin-Film/Wafer Hybrid Silicon Technologies

Cited by 24 publications

References 21 publications

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Heterojunction Interdigitated Back-Contact Solar Cells Fabricated on Wafer Bonded to Glass

Kerfless exfoliated thin crystalline Si wafers with Al metallization layers for solar cells

Role of O2radicals on silicone plasma treatments for a-Si:H surface passivation of PV wafers bonded to glass

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Product

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Role of O₂radicals on silicone plasma treatments for a-Si:H surface passivation of PV wafers bonded to glass