High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

et al. 2019

Fluids

Liquid microjet impingement cooling has shown the potential to be the solution for heat removal from electronic devices such as very-large-scale integration (VLSI) chips. The post-impingement dynamics of the jet, specifically the interaction between the liquid fronts on the surface engendered by the jets is a critical criterion improving the heat transfer characteristics. While some seminally important experimental studies have investigated this attribute, the amount of accurate data and analysis is limited by the shortcomings of real-life experiments. In this article, numerical investigations into the fluid dynamics and heat transfer in microjet cooling systems are carried out. Specifically, this paper addresses the question regarding the necessary fidelity of the simulations. Different Reynolds-averaged Navier–Stokes (RANS) models are compared to the Large Eddy Simulations (LES) simulation and the potential fidelity of different eddy-viscosity-based closures is clearly shown. Recommendations are made regarding the RANS closures that should give the best performance. It is demonstrated that the transition Shear Stress Transport (SST) model and k - ω SST model both show excellent ability to predict the local or average Nu, and also local level pressure coefficient f with less than 5% difference in the range of 30 < Red < 4000, compared with the reference LES model. For the experimental measurements in the range of 130 < Red < 1400, the LES model, transition SST model and k - ω SST model all show less than 25% prediction error. Moreover, it is shown that the validity of the unit cell assumption for the temperature and flow distribution depends on the flow rate.

Section: Introductionmentioning

confidence: 99%

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

et al. 2019

Fluids

“…In order to evaluate he performance of the jet impingement cooler, the thermal resistance and pumping power are both considered for the optimization. In the previous study [2], we illustrated the trade-off between thermal resistance and pump power: the thermal resistance can be further reduced by increasing the flow rate, however at the expense of the required pump power. In this work, the impact of the cooler geometry on the two objective values|(thermal resistance and pump power) is studied systematically.…”

Section: A Nozzle Array Scaling Analysismentioning

confidence: 99%

“…Thermal management of high performance electronic applications becomes more and more challenging, especially for three-dimensional (3D) chip stacks [1]. Liquid jet impingement cooling with a locally distributed return network is regarded as an efficient way to cool down the chip temperature [2]. In order to be compatible with the chip packaging process flow, different fabrication techniques were investigated to build chip level cooler with micron-size jet arrays, such as Si DRIE microfabrication [3], multilayer ceramic technology (MLC) [4] and lithography electroforming micro molding (LIGA) [5].…”

Section: Introductionmentioning

confidence: 99%

“…However, these techniques are all very expensive. We previously demonstrated that cost efficient mechanical micro-machining techniques could be used to fabricate a polymer chip level 3D-shaped cooler with sub-mm nozzle diameters with a very good thermal performance [2]. The mechanical machining process has however limitations to further scale down the nozzle diameters in order to obtain better thermal performance.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

et al. 2018

Self Cite

Liquid jet impingement cooling is a very efficient cooling technology for high performance devices. Previous studies demonstrated that polymers can be used as a cost effective alternative for Si for the fabrication of impingement coolers. The recent developments in additive manufacturing or 3D printing technology enable the potential to fabricate low cost polymer coolers with complex internal channels. In this paper, the use of 3D printing is discussed for the fabrication of a chip level polymer impingement cooler. The paper presents the cooler design, the manufacturability aspects and the characterization of several 3D printed coolers with different nozzles arrays. The challenges and opportunities for the use of 3D printing for this applications are discussed. A methodology to provide design guidelines for 3D printed liquid impingement jet coolers is elaborated.

“…In literature, detailed reports cover experimental, theoretical and numerical analyses of different impingement jet configurations. These configurations range from single submerged jet [5], to multiple submerged jets [6], and impinging jet cooling of electronic modules [7,8], configurations with common return [6] and with distributed returns [8]. However, limited experimental studies focus on chip level impingement jet cooling with locally distributed outlets due to the complicated internal cooler structures with sub-mm dimensions.…”

Section: Introductionmentioning

confidence: 99%

Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip

Applied Thermal Engineering

et al. 2019

Self Cite