High-Efficiency Silicon Solar Cells With Boron Doping in the Back Surface Field via Silicon Paste

Kirkendall void formation in reverse step graded Si1−xGex/Ge/Si(001) virtual substrates

“…: Cu/CuSn interfaces) [3] and bonding between metals (e.g. : Au and Al) to semiconductors in integrated circuits [4] and photovoltaic cells [5,6]. Plastic deformation caused by thermal aging and electromigration have been shown to aid nucleation and growth of voids leading to poor electrical conductivity to the contacts.…”