2009
DOI: 10.1016/j.mee.2009.01.014
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High flowability monomer resists for thermal nanoimprint lithography

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Cited by 6 publications
(6 citation statements)
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“…(1) and (2) are productivity-related requirements, and (3) and (4) are quality-related requirements. After a study by Chou et al [2], research on TH-NIL etching began to gather momentum, but most of it was focused on physical phenomena that occur during processing such as filling, the material properties of the substrate and other materials, stamp manufacturing, and the quality and applications of manufactured shapes [23][24][25][26][27][28][29][30]. Meanwhile, studies on hot plates were conducted as the development of TH-NIL equipment moved forward [31][32][33][34][35].…”
Section: Nil Methods Process Details Mold/substrate Resist Materialsmentioning
confidence: 99%
“…(1) and (2) are productivity-related requirements, and (3) and (4) are quality-related requirements. After a study by Chou et al [2], research on TH-NIL etching began to gather momentum, but most of it was focused on physical phenomena that occur during processing such as filling, the material properties of the substrate and other materials, stamp manufacturing, and the quality and applications of manufactured shapes [23][24][25][26][27][28][29][30]. Meanwhile, studies on hot plates were conducted as the development of TH-NIL equipment moved forward [31][32][33][34][35].…”
Section: Nil Methods Process Details Mold/substrate Resist Materialsmentioning
confidence: 99%
“…As an example, with a 1000 mPa.s viscosity resist, a 13 bar pressure and an optimized initial resist thickness (final residual layer <20nm),themeanfreepath (or flowing distance) of a resist molecule was experimentally estimated to be about 1 mm [28]. This value is important for design of the mold, which has to exhibit homogeneous protrusion density (protrusion to cavity area ratio) on any 1 mm 2 areasonitssurfaceinordertofavorauniformresiduallayer .Inthisexample,the resist redistribution area was quite small but, when using lower viscosity resists (g 0 < 50 mPa.s), this area should reach almost the stamp size in the case of small stamps.…”
Section: Resist Flow In Thin Layersmentioning
confidence: 99%
“…In‐situ polymerization of low viscosity monomer solution provides high flowability and redistribution within the mold cavities for full patterning. [ 18 ] In comparison, direct fabrication of particles from polymers involves heating the polymer to above its T g , at which it behaves as a viscous liquid and starts “flowing” and thereby conforming to the mold. [ 19 ] Highly entangled polymer chains and intermolecular forces between them at their melt state, inherent to polymers, increase their resistance to flow.…”
Section: Introductionmentioning
confidence: 99%