High Frequency Characteristics of Glass Interposer

Tanaka, Masaya; Kuramochi, Satoru; Tai, Takahiro; Sato, Yoichiro; Kidera, Nobutaka

doi:10.1109/ectc32862.2020.00100

Cited by 18 publications

(4 citation statements)

References 3 publications

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“…A resin film can be laminated as an insulation layer in the TGVs [85]. Partial filling technology can be compared to full filling technology in terms of electrical performance [86], and the electroplating time and costs are optimized to some extent. ALD demonstrates superior microporous filling performance compared to PVD and can be effectively utilized in the TSV process to deposit the insulation, barrier, and seed layers.…”

Section: Electroplating Methodsmentioning

confidence: 99%

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Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu,

Wu,

Zhong

et al. 2023

Sensors

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Glass has emerged as a highly versatile substrate for various sensor and MEMS packaging applications, including electromechanical, thermal, optical, biomedical, and RF devices, due to its exceptional properties such as high geometrical tolerances, outstanding heat and chemical resistance, excellent high-frequency electrical properties, and the ability to be hermetically sealed. In these applications, Through Glass Via (TGV) technology plays a vital role in manufacturing and packaging by creating electrical interconnections through glass substrates. This paper provides a comprehensive summary of the research progress in TGV fabrication along with its integrations, including through via formation and metallization. This paper also reviews the significant qualification and reliability achievements obtained by the scientific community for TGV technology. Additionally, this paper summarizes the application of TGV technology in various sensors such as MEMS sensors and discusses the potential applications and future development directions of TGV technology.

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Section: Electroplating Methodsmentioning

confidence: 99%

Section: Through Glass Vias’ Formation and Metallization Techniquesmentioning

confidence: 99%

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Yu,

Wu,

Zhong

et al. 2023

Sensors

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“…Fused silica, a material prized for its superior optical transparency, thermal stability, and notably low dielectric constant, is extensively utilized across a broad range of high-tech industries including optic, [1,2] semiconductor, [3] and high-frequency communications. [4,5] The increased demand for advanced and precise manufacturing technologies to process fused silica has led to the development and refinement of several specialized techniques including lithography and etching, [6][7][8] nano-imprint, [9,10] and ultrafast laser processing. [11][12][13] Through glass vias (TGVs) are pivotal in creating vertical connections on glass substrates, predominantly utilized in integrated circuits and microelectronic devices fabrication.…”

Section: Introductionmentioning

confidence: 99%

Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels

Liu,

Xia,

Ming

et al. 2024

Adv Eng Mater

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At present, perforation of high aspect ratio through glass vias (TGVs) is one of the primary factors limiting the development of glass interposers. This study is based on a large number of experiments, combined with mechanistic analysis, to realize the perforation of ultra‐high/high aspect ratio fused silica TGVs using selective laser‐induced etching (SLE). Firstly, the effect of the number of pulses as well as other laser parameters on the etching selectivity is systematically investigated. It is found that the formation of nanochannels in fused silica is crucial in determining the high selectivity. Subsequently, a model based on diffusion theory is proposed to mathematically explain the reasons for the high selectivity generation. Finally, the perforations of TGVs with diameters of 5.4 µm ‐ 26.4 µm, aspect ratios of 11.7 ‐ 61.3 and vertical sidewalls are achieved, at a laser treatment speed of approximately 10,000 TGVs per minute. This research can serve as an essential reference for the manufacturing of TGVs with high aspect ratios and glass interposers with high interconnection density.This article is protected by copyright. All rights reserved.

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“…The fan-out package structure has good electrical and thermal performance and is used in many applications for system integration. Moreover, packaging-on-packaging (PoP) technology allows packages to be stacked three-dimensionally, thus achieving high-density integration and improving chip-to-chip performance (e.g., in applications with high-frequency data exchange between application processes and memory) [ 1 , 2 , 3 ].…”

Section: Introductionmentioning

confidence: 99%

Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

2021

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The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

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High Frequency Characteristics of Glass Interposer

Cited by 18 publications

References 3 publications

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels

Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

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