High Frequency MEMS Capacitive Mirror for Space Applications

Bagolini, Alvise; Sitar, Anže; Porcelli, L.; Boscardin, M.; Dell’Agnello, S.; Monache, G. Delle

doi:10.3390/mi14010158

Cited by 6 publications

(4 citation statements)

References 11 publications

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“…Then it seems reasonable to increase E near the edges while minimizing it in the center of the device. A good formulation for p, widely used for modeling purposes in industrial field (Pelesko, 2002;Aljadiri et al, 2017;Yu et al, 2023;Bagolini et al, 2023), is:…”

Section: About the Dielectric Profile Of The D-microplatementioning

confidence: 99%

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Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Versaci,

Angiulli,

Fattorusso

et al. 2024

COMPEL

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Purpose Based on previous results of the existence, uniqueness, and regularity conditions for a continuous dynamic model for a parallel-plate electrostatic micro-electron-mechanical-systems with the fringing field, the purpose of this paper concerns a Galerkin-FEM procedure for deformable element deflection recovery. The deflection profiles are reconstructed by assigning the dielectric properties of the moving element. Furthermore, the device’s use conditions and the deformable element’s mechanical stresses are presented and discussed. Design/methodology/approach The Galerkin-FEM approach is based on weighted residuals, where the integrals appearing in the solution equation have been solved using the Crank–Nicolson algorithm. Findings Based on the connection between the fringing field and the electrostatic force, the proposed approach reconstructs the deflection of the deformable element, satisfying the conditions of existence, uniqueness and regularity. The influence of the electromechanical properties of the deformable plate on the method has also been considered and evaluated. Research limitations/implications The developed analytical model focused on a rectangular geometry. Practical implications The device studied is suitable for industrial and biomedical applications. Originality/value This paper proposed numerical approach characterized by low CPU time enables the creation of virtual prototypes that can be analyzed with significant cost reduction and increased productivity.

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Section: About the Dielectric Profile Of The D-microplatementioning

confidence: 99%

“…, 2017; Yu et al. , 2023; Bagolini et al. , 2023), is: because the center of the device highlights instability, where E has the greatest influence.…”

Section: The Dynamic Continuous Modelmentioning

confidence: 99%

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Versaci,

Angiulli,

Fattorusso

et al. 2024

COMPEL

View full text Add to dashboard Cite

show abstract

“…Because of its advantages—small size, ultra-low power consumption, low cost, high integration density, and stable reliability—MEMS is increasingly important for the entire semiconductor ecosystem. It has been widely used in defense, high-speed optical communication, the aerospace and automotive industries, medical equipment, and smart terminal devices [ 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Beam Scanning and Capture of Micro Laser Communication Terminal Based on MEMS Micromirrors

et al. 2023

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With the development of space laser communication and the planned deployment of satellite Internet constellations, there is a growing demand for microminiature laser communication terminals. To meet the requirements of size, weight and power (SWaP), miniaturized terminals require smaller drive components to complete on-orbit scanning and capture, which must be fast and efficient to enable satellite laser communication networks. These miniaturized laser communication terminals are highly susceptible to the impact of the initial pointing accuracy of the laser beam and microvibrations of the satellite platform. Therefore, this paper proposes a laser scanning-capture model based on a Micro-electromechanical Systems (MEMS) micromirror that can provide a fast, large-scale scanning analysis. A scanning overlap factor is introduced to improve the capture probability under the influence of microvibrations. Finally, experimental analysis was carried out to verify the effectiveness of the proposed model, which can establish a theoretical basis for future ultra-long-distance microspace laser communication.

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“…The MEMS technology used in microfabrication and micromachining processes was utilized to develop microactuators [ 9 , 10 , 11 , 12 , 13 ] and microsensors [ 14 , 15 , 16 , 17 , 18 ]. Many studies presented the use of the MEMS technology in developing various MFSs.…”

Section: Introductionmentioning

confidence: 99%

Design and Measurement of Microelectromechanical Three-Axis Magnetic Field Sensors Based on the CMOS Technique

Hsu

Tsai

et al. 2023

Micromachines

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The design, fabrication, and measurement of a microelectromechanical system (MEMS) three-axis magnetic field sensor (MFS) based on the commercial complementary metal oxide semiconductor (CMOS) process are investigated. The MFS is a magnetic transistor type. The performance of the MFS was analyzed employing the semiconductor simulation software, Sentaurus TCAD. In order to decrease the cross-sensitivity of the three-axis MFS, the structure of the MFS is planed to accommodate two independent sensing components, a z-MFS utilized to sense magnetic field (M-F) in the z-direction and a y/x-MFS composed of a y-MFS and a x-MFS to be utilized to sense M-F in the y- and x-directions. The z-MFS incorporates four additional collectors to increase its sensitivity. The commercial 1P6M 0.18 μm CMOS process of the Taiwan Semiconductor Manufacturing Company (TSMC) is utilized to manufacture the MFS. Experiments depict that the MFS has a low cross-sensitivity of less than 3%. The sensitivities of z-, y-, and x-MFS are 237 mV/T, 485 mV/T, and 484 mV/T, respectively.

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High Frequency MEMS Capacitive Mirror for Space Applications

Cited by 6 publications

References 11 publications

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Galerkin-FEM approach for dynamic recovering of the plate profile in electrostatic MEMS with fringing field

Beam Scanning and Capture of Micro Laser Communication Terminal Based on MEMS Micromirrors

Design and Measurement of Microelectromechanical Three-Axis Magnetic Field Sensors Based on the CMOS Technique

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