2019 22nd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2019
DOI: 10.23919/empc44848.2019.8951834
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High Frequency Substrate Technologies for the Realisation of Software Programmable Metasurfaces on PCB Hardware Platforms with Integrated Controller Nodes

Abstract: Manessis, D.; Seckel, M.; Liu, Fu; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C. M.; Tretiakov, Sergei; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K. D.High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes AbstractThe proposed work is performed in the framework of the FET-% 8:72-+< D&# "#%"E ?01+0 has undertake… Show more

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Cited by 5 publications
(4 citation statements)
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“…In this work, focus is mainly given on the chip design and its features. For elaboration on the EM aspects and capabilities of metasurfaces consisting of these chips, the reader is encouraged to read [34], [35], [36], [37], [38], [39], [40], [41], [42].…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…In this work, focus is mainly given on the chip design and its features. For elaboration on the EM aspects and capabilities of metasurfaces consisting of these chips, the reader is encouraged to read [34], [35], [36], [37], [38], [39], [40], [41], [42].…”
Section: Discussionmentioning
confidence: 99%
“…At the bottom/back side, there are signal wires to convey the configuration data between the chips. The design of the PCB is described in details in [41] showing the asymmetric layer stack-up, while the manufacturing of the PCB is described in [42] detailing the techniques used to manufacture wires with 45 μm width and blind vias with 150 μm diameter on high-frequency substrates. Although the presented system is simple and symmetric, there are important constraints added to the design of the IC from the application and the operation at GHz frequencies, which are described below.…”
Section: A General Structure Of the Programmable Meta-atommentioning
confidence: 99%
“…This and other issues such as the choice of substrate materials [92], the practicality of the tuning elements [11], [12], or the space left to integrate controllers and I/O pins at the unit cell level are greatly dependent on the metasurface frequency, whereas the computational requirements of the control logic hinge on the refresh rate imposed by the final applications. Within this context, we next review the prospects of promising technologies towards high-speed high-frequency programmable metasurfaces.…”
Section: Technologymentioning
confidence: 99%
“…The structured metal is then manipulated through active components to absorb or reflect with a certain phase shift. Lumped elements are either located directly at the front as in [5]- [7] or behind the back side, connected to the periodic layer through vias [8], [9]. Both of these design principles exhibit disadvantages in high-frequency applications.…”
Section: Introductionmentioning
confidence: 99%