High-frequency thin-film multijunction thermal converter on a quartz crystal chip

Scarioni, L.; Klonz, M.; Janik, Dieter; Laiz, H.; Kampik, Marian

doi:10.1109/tim.2003.810011

Cited by 25 publications

(11 citation statements)

References 8 publications

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“…The model for the calculation of the ac-dc voltage transfer difference of the Quartz-MJTC using the integrated Tee, includes the ac-dc differences arising from [4]: 1. Change of the real part of the heater impedance with frequency.…”

Section: Simulation Of Quartz-mjtcmentioning

confidence: 99%

Design and fabrication of MJTCs on quartz substrates at NIST

Scarioni¹,

Lipe²,

Kinard³

2008

2008 Conference on Precision Electromagnetic Measurements Digest

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Dry etching is employed in the fabrication of new planar, thin-film multijunction thermal converters (MJTCs) on quartz membranes and crystalline quartz chips at NIST. The use of crystalline quartz as a material for the membrane and for the chip improves the performance of the MJTC in the frequency range from 100 kHz to 100 MHz. Simulations of the ac-dc voltage transfer difference for a heater resistance of 400 Ω in the frequency range from 1 MHz to 100 MHz show a reduction in the ac-dc transfer difference of more than one order of magnitude in comparison with MJTCs fabricated on silicon chips.

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Section: Simulation Of Quartz-mjtcmentioning

confidence: 99%

Design and fabrication of MJTCs on quartz substrates at NIST

Scarioni¹,

Lipe²,

Kinard³

2008

2008 Conference on Precision Electromagnetic Measurements Digest

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“…To obtain standards with improved performance at high frequencies, both the Physikalisch-Technische Bundesanstalt (PTB) [2] and NIST [3] have developed MJTCs based on crystalline quartz and fused silica substrates. Crystalline quartz and fused silica both have much smaller relative permittivities (ε r ≈ 3.8) than silicon, which reduces capacitive coupling between the heater and thermocouples, and between bonding pads, and improves the high-frequency performance.…”

Section: Introductionmentioning

confidence: 99%

New high-frequency MJTCs of novel design on fused silica substrates

Lipe

Kinard

Novotny

2012

2012 Conference on Precision Electromagnetic Measurements

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We are presently deploying new thin-film multijunction thermal converters fabricated on fused silica substrates for highly accurate ac voltage measurements at frequencies up to 100 MHz. Devices fabricated thus far include both bifilar and coaxial designs, and are being tested as new standards in the 2 V to 5 V range. We report on the performance of these new MJTCs, describe present work to improve their performance and discuss future goals.

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“…This is achieved by comparing the root‐mean‐square (RMS) power of the AC voltage with that of the standard DC using thermal converters [2]. Various types of thermal converters have been developed by national standard laboratories to establish primary reference in AC–DC transfer standard in the frequency range between 10 Hz and 1 MHz [3–5].…”

Section: Introductionmentioning

confidence: 99%

Development of a thermal voltage converter with calculable high‐frequency characteristics

Sasaki

Kasai

Fujiki

et al. 2011

IEEJ Transactions Elec Engng

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A thermal‐voltage converter for high‐frequency (HF‐TVC) AC–DC transfer standard has been developed. The HF‐TVC was designed such that the frequency characteristic is calculable from the shape and dimension of the input circuit. A new multi‐junction thermal converter element (JSTC04) has been developed, which has a simple and straight heater configuration to minimize the parasitic impedances in the input circuit. The AC–DC difference of the HF‐TVC was evaluated by two independent methods, with agreement better than 7 µV/V up to 1 MHz. © 2011 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

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High-frequency thin-film multijunction thermal converter on a quartz crystal chip

Cited by 25 publications

References 8 publications

Design and fabrication of MJTCs on quartz substrates at NIST

Design and fabrication of MJTCs on quartz substrates at NIST

New high-frequency MJTCs of novel design on fused silica substrates

Development of a thermal voltage converter with calculable high‐frequency characteristics

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