High-Gain $D$ -Band Transmitarrays in Standard PCB Technology for Beyond-5G Communications

Abstract

We present novel three-layer D-band linearly-polarized transmitarrays entirely fabricated using standard printed circuit board (PCB) processes. Three flat lenses comprising 1600 elements are designed to generate broadside and scanned beams. All lenses are synthesized using 8 unit cells (3-bit phase quantization). The combination of cells comprising probe-fed and aperture-coupled patches is proposed to overcome the design challenges due to technological constraints and achieve a wideband operation. The minimum design feature is 80 µm. The trade-offs in the design of the feed illumination are analyzed using adhoc numerical tools. A 10-dBi horn is eventually selected as source. The focal-to-diameter (F/D) ratio is 0.75 for all lenses. The broadside array attains a peak gain of 33.0 dBi and a -1-dB relative gain bandwidth of 11.7%, i.e. wider than that of state-of-the-art designs, in the 100-300-GHz band, which use more complex technologies and larger focal distances. The performance of the proposed antenna technology demonstrates its potential for low-cost high-capacity wireless backhauls beyond 100 GHz.

Low‐profile and low‐cost transmitarray antenna at 122 GHz based on unit‐cells with 1‐bit phase resolution

“…A vector network analyser and a rotation platform are used to measure the radiated power in relation to the azimuth angle. Compared to the D ‐band transmitarray realisation in [16 ] the thickness of the profile could be halved.…”

High-Gain Millimeter-Wave Beam Scanning Transmitarray Antenna

“…There are relatively few reported works realizing a high gain for frequencies higher than 100 GHz. According to the processing methods, 3-D printing lens [ 11 ], curved-surface dielectric lens [ 12 , 13 ], all-metallic lens or transmitarrays [ 14 , 15 , 16 ], low-temperature co-fired ceramic (LTCC) technology transmitarrays [ 17 ], and standard printed circuit board (PCB) technology transmitarrays [ 18 , 19 ], are adopted for high gain forming in the sub-terahertz band (100–300 GHz). A transmitarray at 140 GHz is fabricated using multilayered LTCC technology [ 17 ], where the parasitic patches are selected as transmitting elements.…”

Lifetime Prediction and Aging Mechanism of Glass Fiber Reinforced Acrylate‐Styrene‐Acrylonitrile/Polycarbonate Composite under Hygrothermal Conditions

“…The existing literature pertaining to mobile antennas indicates that they have been primarily developed via substrate-based processes using materials such as Teflon, [5][6][7] low-temperature co-fired ceramics, [8][9][10][11] and printed circuit boards. [12,13] Nevertheless, most relevant studies conducted thus far have focused on the antenna architecture, whereas the material science technology employed in the antenna manufacturing process is not considered. Owing to the high-density nature of commercially available mobile devices that incorporate numerous components, the amount of space available for antenna design is extremely low.…”