2019
DOI: 10.1002/app.48641
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High glass transition temperature shape‐memory materials: Hydroxyl‐terminated polydimethylsiloxane‐modified cyanate ester

Abstract: Hydroxyl-terminated polydimethylsiloxane (HTPDMS) and hydrogenated bisphenol A-type epoxy resin (AL-3040) were coreacted with a silane coupling agent (KH-550) to form an AL-3040 epoxy resin-HTPDMS block copolymer. Then, the copolymer was used as a compatibilizer to modify cyanate ester with different mass ratios. Subsequently, the blend was cured to form HTPDMSmodified shape-memory cyanate ester. The soft Si─O─Si segments of HTPDMS act as a flexible unit that can be grafted with the crosslinked triazine struct… Show more

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Cited by 17 publications
(11 citation statements)
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“…Shape memory polymers (SMPs) are key materials for preparing sensors 1,2 and spatial self-expanding structures. 3 The rapid development of modern industry increasingly asks for SMPs with high heat resistance and suitable flame retardancy. 4 However, being organic polymers, almost all SMPs do not have excellent flame retardancy.…”
Section: Introductionmentioning
confidence: 99%
“…Shape memory polymers (SMPs) are key materials for preparing sensors 1,2 and spatial self-expanding structures. 3 The rapid development of modern industry increasingly asks for SMPs with high heat resistance and suitable flame retardancy. 4 However, being organic polymers, almost all SMPs do not have excellent flame retardancy.…”
Section: Introductionmentioning
confidence: 99%
“…It is well known that the movement of the molecular chain with a higher crosslinking density is constrained, thus a higher T g is obtained. [38]…”
Section: Dmta Studiesmentioning
confidence: 99%
“…However, the water absorption rate grows with the further increase of CE content, which is due to the corresponding increase of high crosslinking triazine rings with large intermolecular free volume. [38] Lots of water enters into the cavities, so a higher water absorption is achieved.…”
Section: Water Absorptionmentioning
confidence: 99%
“…Thus, the resin should be toughened to meet the requirements of packaging performance, and the components must withstand high-speed and high-frequency conditions. The usual toughening methods are as follows: (1) a copolymerization with thermosetting resins [1][2][3], (2) a blend of hightemperature-resistant and low-dielectric thermoplastic resins [4][5][6], (3) the formation of an interpenetrating polymer network (IPN) with a rubber elastomer or block copolymer with linear macromolecules, [7][8][9][10][11], and (4) the introduction of polyhedral oligomeric silsesquioxane (POSS) or nanoparticles into the system [12][13][14]. Copolymerization with a thermosetting resin could perform a hybrid homogeneous network resin structure with improved properties but the limited toughening degree.…”
Section: Introductionmentioning
confidence: 99%