High heat flux phase change on porous carbon nanotube structures

Cai, Qingjun; Bhunia, Avijit

doi:10.1016/j.ijheatmasstransfer.2012.05.027

Cited by 54 publications

(13 citation statements)

References 18 publications

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“…Subsequent studies by Cai et al [46,47] investigated additional CNT biwick morphologies with parallel CNT stripes, zig-zag CNT stripes, and hexagonally packed CNT clusters, as shown in Figure 34. Thermal testing was performed in a saturated environment using two different heat input areas, 4 mm 2 and 100 mm 2 .…”

Section: Nanowire Array Wicksmentioning

confidence: 99%

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Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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Owing to their high reliability, simplicity of manufacture, passive operation, and effective heat transport, flat heat pipes and vapor chambers are used extensively in the thermal management of electronic devices. The need for concurrent size, weight, and performance improvements in high-performance electronics systems, without resort to active liquid-cooling strategies, demands passive heat spreading technologies that can dissipate extremely high heat fluxes from small hot spots. In response to these daunting application-driven trends, a number of recent investigations have focused on the design, characterization, and fabrication of ultra-thin vapor chambers for proximate heat spreading away from these hot spots. The predominant transport mechanisms and operational limits have been found to be different under these conditions relative to conventional low-power heat pipes. Noteworthy advances in the fundamental understanding of evaporation and boiling from porous microstructures fed by capillary action, and improvements in vapor chamber characterization, modeling, design, and fabrication techniques are reviewed. Characterization of evaporation and boiling from idealized and realistic wick structures, observation of vapor formation regimes as a function of operating conditions, assessment of fluid dryout limitations, design of novel multi-scale and nanostructured wicks for enhanced transport, and incorporation of these high heat flux transport phenomena into device-level models are discussed. These recent developments have successfully extended the maximum operating heat flux limits of vapor chambers.2

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Section: Nanowire Array Wicksmentioning

confidence: 99%

“…heat input area across all sample morphologies tested (see Section 2.5 for additional discussion) [46,47]. …”

Section: Nanowire Array Wicksmentioning

confidence: 99%

Recent Advances in Vapor Chamber Transport Characterization for High-Heat-Flux Applications

Weibel

Garimella

2013

Advances in Heat Transfer

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“…The extended meniscus improves the thermal transport and the rate of heat dissipation near the thin-film region by increasing the evaporation area and decreasing the conduction resistance [8,12]. The area of the extended meniscus and the thin-film region can be increased to maximize the rate of heat dissipation by varying the surface area-to-volume ratio via micro/nano-structuring [11,13]. More importantly, these micro/nano-structured surfaces can offer the advantage of passive liquid transport via capillary wicking, such as in heat pipes [9,10].…”

Section: Porosity (-) Water 1 Introduction and Backgroundmentioning

confidence: 99%

Design of micropillar wicks for thin-film evaporation

Adera

Antao

Raj

et al. 2016

International Journal of Heat and Mass Transfer

128

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The generation of concentrated heat loads in advanced microprocessors, GaN electronics, and solar cells present significant thermal management challenges in defense, space and commercial applications. Liquid to vapor phase-change strategies are promising due to the high latent heat of vaporization of the working fluid. In particular, thin-film evaporation has received increased interest owing to advances in micro/nanofabrication and the potential to dissipate high heat fluxes by increasing the evaporative meniscus area. Yet, predictive tools to design various wicking structures are limited due to the complexity of the thermal-fluidic transport. In this work, we performed systematic experiments to characterize capillary-limited thin-film evaporation from silicon micropillar wicks in the absence of nucleate boiling. The insights gained from experiments were used to model the capillary pressure, permeability, and thermal resistance. Accordingly, we developed a semi-analytical model to determine the capillary-limited dryout heat flux and wall temperature with ±20% accuracy, compared to our experiments. The model provides a versatile platform to design and optimize micropillar wicks for next generation thermal management devices.International Journal of Heat and Mass Transfer 56 Nomenclature Area (m 2 ) Correction factor/height ratio (-)

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“…Thin film evaporation associated with phase-change heat transfer in micro-scale cooling devices manifests itself in superior electronic cooling applications due to the high heat transfer coefficients [1][2][3]. An evaporating thin film forms an extended meniscus which can be typically divided into three regions, namely the equilibrium nonevaporating (adsorbed) film region, the evaporating film region, and the intrinsic meniscus region [4,5], as depicted in Fig.…”

Section: Introductionmentioning

confidence: 99%