High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys

Ali, Bakhtiar; Sabri, Mohd Faizul Mohd; Said, Suhana Mohd; Sukiman, Nazatul Liana; Jauhari, Iswadi; Soin, Norhayati

doi:10.1007/s10854-017-6412-x

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High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys

Cited by 3 publications

References 32 publications

Interfacial reaction characteristics of Cu/Sn-0.3Ag-0.7Cu-xNi/Cu-soldered joints after isothermal aging

Interfacial reaction characteristics of Cu/Sn-0.3Ag-0.7Cu-xNi/Cu-soldered joints after isothermal aging

Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

Pb-free solder—microstructural, material reliability, and failure relationships

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