2022
DOI: 10.1016/j.est.2022.104293
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High interface compatibility and phase change enthalpy of heat storage wood plastic composites as bio-based building materials for energy saving

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Cited by 25 publications
(9 citation statements)
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“…In spite of this, all the form-stable PCMs exhibited a higher thermal conductivity than that of pure paraffin. The use of recyclable skeletons such as biomass cellulose nanocrystals, [89] fly ash, [92] kapok fiber, [91] and wood fiber [90] had also improved the thermal conductivity of the formstable PCMs by more than 5% compared to the pure organic PCMs. Huang et al [89] prepared form-stable F I G U R E 9 (a) Schematic diagram of heat transfer between form-stable PCMs particles.…”
Section: Thermal Conductivitymentioning
confidence: 99%
“…In spite of this, all the form-stable PCMs exhibited a higher thermal conductivity than that of pure paraffin. The use of recyclable skeletons such as biomass cellulose nanocrystals, [89] fly ash, [92] kapok fiber, [91] and wood fiber [90] had also improved the thermal conductivity of the formstable PCMs by more than 5% compared to the pure organic PCMs. Huang et al [89] prepared form-stable F I G U R E 9 (a) Schematic diagram of heat transfer between form-stable PCMs particles.…”
Section: Thermal Conductivitymentioning
confidence: 99%
“…They also had good thermal reliability after 500 heating and cooling cycles. Zhao et al (2022) used a WPC composite as the matrix to incorporate PEG/organic diatomite, a latent heat storage agent. The resulting composite had a latent heat of fusion of 60.4 J/g.…”
Section: Other Applications Of Pcm In Wood-based Composite Materialsmentioning
confidence: 99%
“…Experimental findings showed that the encapsulation method maximised storage capacity to 97.2 W h and rendered a highest possible energy charging speed of 109.4 W. On the other hand, Zhao et al. created a composite PCM using encapsulated Polyethylene Glycol (PEG) and Organic Diatomite (OD) with a matrix of Wood Fibre (WF) and HDPE [105] . Their results showed that the obtained FSPCM has great interface action, a high latent heat of 105.35 J g −1 and optimal packaging capability.…”
Section: Energy‐saving Buildings With Pe‐pcmsmentioning
confidence: 99%