High manufacturability and thermal stability mini-flat transmitter for 10Gb/s Ethernet applications

Abstract

The key issues of local-area-network (LAN) and metropolitan area network (MAN) applications are to improve cost, manufacturabilily and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated low cost, high manufacturability and thermal stability mini-transmitLer for 10Gh/s Ethemet applications in this paper. A novel two lens semi-passive alignment structure of 10Gb/s 1310nm SC receptacle or pigtail type optical miniflat transmitter are designed and demonstrated to exhibit about 35% coupling el'ficiency with *5pm accuracy flip chip bonder general process of silicon optical bench (SiOB) and packaging flow. Moreover, a high resistivity silicon optical bench (IkWcm) and pressure-free bonding technique using the electroplated gold-!:in solder are also adopted to guarantee the transmitted performance in high speed operation. The eye diagram of 10Gb/s mini-flat transmitter developed in this study shown the excellent quality obtained passing IOGb/s Ethernet mask test with 30% margin. And the extinction ratio of transmitter is also proved to above 6dB at room temperature. The optical eye diagram of 1 OGbls transmitter developed in this study showing excellent eye quality passing 10Gb/s Ethernet mask test between O°C to 80'C. Finally, the reliability of transmitter is also performed in this paper.