2018 9th Inthernational Conference on Computer Aided Design for Thin-Film Transistors (CAD-TFT) 2018
DOI: 10.1109/cad-tft.2018.8608103
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High mobility metal-oxide thin film transistors with IGZO/In<inf>2</inf>O<inf>3</inf> dual-channel structure

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Cited by 3 publications
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“…[1][2][3][4] Numerous studies have been conducted on novel channel materials, new device structure, and post-process to explore the potential application in advanced displays. [5][6][7][8][9] In addition to the conventional applications of TFTs in display, publications of TFTs in ferroelectric field-effect transistors, neuromorphic computing devices, and memory cells indicate the potential application of ITO TFTs in new generation ICs. [10][11][12][13][14][15][16][17][18][19][20] Indium-tin-oxide (ITO) is a material widely used in optoelectronics and frequently used as the source/drain electrode of devices due to high transparency and high electron density exceeding 10 20 /cm 3 which is too high for the channel layer material.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4] Numerous studies have been conducted on novel channel materials, new device structure, and post-process to explore the potential application in advanced displays. [5][6][7][8][9] In addition to the conventional applications of TFTs in display, publications of TFTs in ferroelectric field-effect transistors, neuromorphic computing devices, and memory cells indicate the potential application of ITO TFTs in new generation ICs. [10][11][12][13][14][15][16][17][18][19][20] Indium-tin-oxide (ITO) is a material widely used in optoelectronics and frequently used as the source/drain electrode of devices due to high transparency and high electron density exceeding 10 20 /cm 3 which is too high for the channel layer material.…”
Section: Introductionmentioning
confidence: 99%
“…Alternatively, TFTs with multistacked oxide semiconductors were proposed to modify the channel conduction, [ 15 ] where high carrier density channel acts as a mobility booster and low carrier density channel enhances the electrical stability. [ 15–28 ] To achieve superior electrical performance, most of the multistacked MOS channel engineering were performed on back‐channel etch (BCE) TFTs such as gate insulator (GI)/IZO/IGZO, [ 15 ] GI/Sn‐doped In 2 O 3 (ITO)/IGZO, [ 15 ] GI/ITO/Sn‐doped ZnO (ZTO), [ 16 ] and GI/IGZO/ZnO/IZO [ 25 ] without performing additional doping on either of the active channels. The mechanism of high mobility was not discussed including film density, surface morphology, energy band alignment, and interface properties between GI/active layer.…”
Section: Introductionmentioning
confidence: 99%
“…reported BCE multilayer GI/Ti:GZO/IGZO/Ti:GZO TFTs, [ 19 ] where the presence of Ga and Ti cations is claimed to provide better surface roughness, and efficiently suppress excess carriers to achieve positive V Th , but low μ FE and large I OFF are the trade‐offs. Other reports include high‐ k GI/IGZO/IGZO:Ti, [ 23 ] GI/IGZO:N/IZO:N, [ 24 ] GI/IZO:N/IGZO:N, [ 24 ] and GI/IZO:X/IZO [ 27 ] where X is either Al or Ga metals. These reports speculated that the presence of Ti, N, Al, and Ga cations improve μ FE , however, incorporation of Ga cation and N doping in the MOS layer is previously attributed to the reduction of μ FE by suppressing V O defects.…”
Section: Introductionmentioning
confidence: 99%